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원격 측정 시스템을 위한 FR4와 폴리이미드 1.0 밀리미터 엄격한 플렉스 PCBs 3 층

중국 Bicheng Electronics Technology Co., Ltd 인증
중국 Bicheng Electronics Technology Co., Ltd 인증
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— 부유한 리켓

루스, 나는 오늘 PCB를 얻었고 그들이 단지 완벽합니다. 약간의 인내를 멈추게 하시오 그러면 내 다음 명령은 곧 다가오고 있습니다. 종류는 함부르크로부터 주목합니다 올라프

—— 올라프 쿤홀드

하와이 나탈리. 그것은 완벽했습니다, 내가 참고를 위해 약간의 사진을 첨부합니다. 그리고 나는 예산에 당신에게 다음 2 사업을 보냅니다. 다시 대단히 감사합니다

—— 세바스챤 탑리제크

케빈, 감사, 그들이 완전히 만들어졌고, 잘 작동합니다. 약속된 대로 당신이 나를 위해 제조한 PCB를 사용하는 내 최근의 프로젝트를 위한 링크가 여기 있습니다 : 관계, 다니엘

—— 다니엘 포드

제가 지금 온라인 채팅 해요

원격 측정 시스템을 위한 FR4와 폴리이미드 1.0 밀리미터 엄격한 플렉스 PCBs 3 층

FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System
FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System

큰 이미지 :  원격 측정 시스템을 위한 FR4와 폴리이미드 1.0 밀리미터 엄격한 플렉스 PCBs 3 층

제품 상세 정보:
원래 장소: 중국
브랜드 이름: Bicheng
인증: UL, ISO9001, IATF16949
모델 번호: BIC-275.V1.0
결제 및 배송 조건:
최소 주문 수량: 1 PC
가격: USD9.99-99.99
포장 세부 사항: 진공 bags+Cartons
배달 시간: 8-9 작업 일
지불 조건: 전신환
공급 능력: 달 당 5000 PC
상세 제품 설명
기재: 1.0 밀리미터 FR-4 / 0.15 밀리미터 폴리이미드 레이어 총수: 3개의 층
Pcb 간격: 1.0mm PCB 사이즈: 20.23 X 80.91 밀리미터
커버레이: 노란 커버레이 / 녹색 솔더 마스크 실크 스트린: 백색
구리 중량: 1OZ 표면가공도: 침수 금
하이 라이트:

FR4와 폴리이미드 엄격한 플렉스 PCBs

,

1.0mm 엄격한 플렉스 PCBs

,

1.0mm 3 레이어 PCB

 

Rigid-flex PCBs Built on FR-4 and Polyimide with Green Solder Mask and Immersion Gold for Telemetry System

(FPC’s are custom-made products, the picture and parameters shown are just for reference)

 

General description

This is a type of rigid-flex PCB for the application of Telemetry System. It’s a 3 layer of rigid flex PCB. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data.

 

Parameter and data sheet

Size of Flexible PCB 20.23 X 80.91mm
Number of Layers 3
Board Type Rigid flex PCB
Board Thickness 1.0mm
Board Material 1.0mm FR-4 / 0.15mm Polyimide
Board Material Supplier ITEQ
Tg Value of Board Material 60
 
PTH Cu thickness 20 µm
Inner Iayer Cu thicknes 35 µm
Surface Cu thickness 35 µm
   
Coverlay Colour Yellow coverlay / Green solder mask
Number of Coverlay 2
Thickness of Coverlay 25 µm
Stiffener Material no
Stiffener Thickness N/A
   
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 2
 
Peeling test of Coverlay No peelable
Legend Adhesion 3M 90 No peeling after Min. 3 times test
 
Surface Finish Immersion Gold
Thickness of Nickle/Gold Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required Yes
Famability 94-V0
 
Thermal Shock Test Pass, -25±125, 1000 cycles.
Thermal Stress Pass, 300±5,10 seconds, 3 cycles. No delamination, no blistering.
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2

 

원격 측정 시스템을 위한 FR4와 폴리이미드 1.0 밀리미터 엄격한 플렉스 PCBs 3 층 0

원격 측정 시스템을 위한 FR4와 폴리이미드 1.0 밀리미터 엄격한 플렉스 PCBs 3 층 1

 

Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

The end can be whole soldered

Low cost

Continuity of processing

Small quantity order is accepted

DDU Door to door shipment with competitive shipping cost.

 

Applications

LCD module, mobile phone module flex board, Consumer electrostatic Bracelet soft board

 

Structure of FPC

According to the number of layers of conductive copper foil, FPC can be divided into single layer circuit, double layer circuit, multi-layer circuit, double sided and so on.

 

Single-layer structure: the flexible circuit of this structure is the simplest structure of the flexible PCB. Usually the base material (dielectric substrates) + transparent rubber(adhesive) + copper foil is a set of purchased raw materials(semi-manufactures), the protective film and transparent glue are another kind of bought raw material. First, copper foil must be etched to obtain the required circuit, and the protective film should be drilled to reveal the corresponding pad. After cleaning, the two are combined by rolling. Then the exposed part of the pad electroplated gold or tin to protect. In this way, the big panel board will be ready. Generally also it’s stamped into the corresponding shape of the small circuit board. There is also no protective film directly on the copper foil, but printed resistance soldering coating, so that the cost will be lower, but the mechanical strength of the circuit board will become worse. Unless the strength requirement is not high and the price needs to be as low as possible, it is best to apply the protective film method.

 

Double layer structure: when the circuit is too complex to be wired, or copper foil is needed to shield the ground, it is necessary to choose a double layer or even a multilayer. The most typical difference between a multilayer and a single plate is the addition of a perforated structure to connect the layers of copper foil. The first process of transparent rubber + base material + copper foil is to make holes. Drill holes in the base material and copper foil first, clean and then plated with a certain thickness of copper. The subsequent fabrication process is almost the same as the single-layer circuit.

 

Double sided structure: both sides of the double sided FPC have pads, mainly used to connect other circuit boards. Although it and monolayer structure is similar, but the manufacturing process is very different. Its raw material is copper foil, protective film and transparent glue. The protective film should be drilled according to the position of the pad first, then the copper foil should be affixed, the pad and track lines should be etched and then the protective film of another drilled hole should be affixed.

 

원격 측정 시스템을 위한 FR4와 폴리이미드 1.0 밀리미터 엄격한 플렉스 PCBs 3 층 2

원격 측정 시스템을 위한 FR4와 폴리이미드 1.0 밀리미터 엄격한 플렉스 PCBs 3 층 3

 

연락처 세부 사항
Bicheng Electronics Technology Co., Ltd

담당자: Ms. Ivy Deng

전화 번호: 86-755-27374946

팩스: 86-755-27374848

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