2025-09-16
Introduction
Rogers TMM 6 thermoset microwave material is a ceramic thermoset polymer composite designed for high plated thru-hole reliability strip-line and micro-strip applications.It offers a combination of the benefits of both ceramic and traditional PTFE microwave circuit laminates without requiring the specialized production techniques common to those materials, all at a unique dielectric constant (Dk) of 6 compared to other materials in the product family.
Features & Benefits
TMM6 stands out with a range of features that cater to high-performance applications, including a Dielectric Constant (Dk) of 6.0 +/- .080, a low Dissipation Factor of .0023 at 10GHz, and a Thermal Coefficient of Dk of -11 ppm/°K for enhanced thermal stability.
Its Coefficient of Thermal Expansion of 18 ppm/K on X and Y axes matched to copper ensures material integrity, while the availability in a thickness range of .0015 to .500 inches offers design flexibility.
On the benefits front, TMM6 excels in resisting creep and cold flow due to its robust mechanical properties, while its resistance to process chemicals mitigates damage risks during fabrication.
Furthermore, being based on a thermoset resin, TMM6 facilitates reliable wire-bonding, and its compatibility with all common PCB processes streamlines ease of use and application versatility.
PCB Capabilities
Our TMM6 PCB capabilities include manufacturing double-layer, multilayer, and hybrid PCBs to cater to a diverse range of design requirements.
We offer copper weights ranging from 1oz (35 µm) to 2oz (70µm), providing flexibility for varying applications.
PCB thickness options span from 15mil (0.381mm) to 500mil (12.7mm), accommodating different design specifications.
The maximum PCB size available is 400mm X 500mm, enabling the production of boards for various device sizes.
Solder mask options include green, black, blue, yellow, red, and purple, offering customization for visual and functional requirements.
Surface finish options consist of bare copper, HASL, ENIG, OSP, immersion tin, immersion silver, pure gold, and ENEPIG finishes, ensuring compatibility with different assembly processes and environmental conditions.
| PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Designation: | TMM6 |
| Dielectric constant: | 6.0 +/- .080, @ 10GHz |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Laminate thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red, Purple etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold, ENEPIG etc.. |
Applications
TMM6 PCB is commonly used in chip testers for accurate testing, in filters and couplers for signal integrity, in GPS antennas for stability, in patch antennas for consistent signal quality, and in RF circuitry for low signal loss etc.
