회사 소식 Global Giants Lay Out Glass Substrates and Advanced Packaging

As AI chips evolve toward large-size, high-density packaging, global giants are exploring glass substrates, with domestic materials and equipment companies participating in tandem, and the industrial layout now covering multiple segments.

Intel publicly outlined its glass substrate roadmap in 2023, and its EMIB and Foveros packaging platforms provide a foundation for the collaborative development of new substrate materials and packaging structures. In July 2026, Lens Technology and Intel signed a TGV cooperation memorandum, with discussions covering glass through-holes, laser processing, metallization, and multilayer interconnection.

Among other industry giants, media reported in September 2026 that Nvidia is evaluating glass substrates, as HBM and high-speed interconnection bring new substrate requirements. TSMC is developing CoPoS panel-level packaging and has publicly announced trial line plans, with square panels expected to improve area utilization efficiency in large-size packaging. Samsung Electro-Mechanics has demonstrated micro-via, metal filling, and precision processing technologies, and has formed a joint venture with Dongwoo Fine-Chem for glass core business; in October, media reported that it is conducting packaging-level reliability testing in conjunction with customer chips.

The midstream processing segment offers the greatest value increment, and Lens Technology's experience in consumer electronics glass manufacturing provides a foundation for controlling dimensional precision, surface quality, and batch consistency. The company has disclosed progress in hole formation, seed layer deposition, electroplating via filling, and multilayer RDL processes, and is carrying out joint development and validation with North American customers; its memorandum with Intel also makes it one of the clearer cases among A-share companies of industrial collaboration with advanced packaging customers.

On the domestic supporting side, on the equipment front, DR Laser and HGTECH are laying out TGV laser processing, Dongwei Technology is advancing electroplating and deposition equipment, and Tiancheng Technology is developing chemicals required for metallization and via filling. As customer validation deepens, upstream and downstream collaboration will jointly influence the pace of industrialization.

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Source: Securities Market Weekly

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