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크기를 줄이는 폴리이미드 경화제 2 항공 회사 코드 구리 4 층 플렉스 PCB

크기를 줄이는 폴리이미드 경화제 2 항공 회사 코드 구리 4 층 플렉스 PCB

모크: 1 PC
가격: USD9.99-99.99
표준 포장: 진공 bags+Cartons
배달 기간: 8-9 작업 일
지불 방법: 전신환
공급 능력: 달 당 5000 PC
자세한 정보
원래 장소
중국
브랜드 이름
Bicheng
인증
UL, ISO9001, IATF16949
모델 번호
BIC-268.V1.0
기재:
Polyimide
레이어 총수:
4개의 층
Pcb 간격:
0.25mm
PCB 사이즈:
50.22 X 122.17 밀리미터
커버레이:
노랑
실크 스트린:
백색
구리 중량:
70 um
표면가공도:
침수 금
강조하다:

폴리이미드 경화제 4 층 플렉스 PCB

,

2 항공 회사 코드는 4 층 플렉스 PCB를 구리도금합니다

,

폴리이미드 경화제 2 항공 회사 코드 구리 PCB

제품 설명
 

4 Layer Flexible PCB Built on Polyimide with 2 oz Copper and Immersion Gold plus Keypads for Mobile Devices

(FPC’s are custom-made products, the picture and parameters shown are just for reference)

 

General description

This is a type of 4 layer flexible printed circuit for the application of Electronic Counter. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. Polyimide stiffener is applied on the inserting part.

 

Parameter and data sheet

Size of Flexible PCB 50.22 X 122.17mm
Number of Layers 4
Board Type Flexible PCB
Board Thickness 0.25mm
Board Material Poyimide 25µm
Board Material Supplier ITEQ
Tg Value of Board Material 60℃
 
PTH Cu thickness ≥20 µm
Inner Iayer Cu thicknes N/A
Surface Cu thickness 70 µm
   
Coverlay Colour Yellow
Number of Coverlay 1
Thickness of Coverlay 25 µm
Stiffener Material Polyimide
Stiffener Thickness 0.2mm
   
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
 
Peeling test of Coverlay No peelable
Legend Adhesion 3M 90℃ No peeling after Min. 3 times test
 
Surface Finish Immersion Gold
Thickness of Nickle/Gold Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required Yes
Famability 94-V0
 
Thermal Shock Test Pass, -25℃±125℃, 1000 cycles.
Thermal Stress Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2

 

크기를 줄이는 폴리이미드 경화제 2 항공 회사 코드 구리 4 층 플렉스 PCB 0

크기를 줄이는 폴리이미드 경화제 2 항공 회사 코드 구리 4 층 플렉스 PCB 1

 

Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

Material optionality

Low cost

Continuity of processing

Diversified shipping method

Eligible products rate of first production: >95%

 

Applications

LCD module, mobile phone antenna flex board, consumer card reader soft board

 

Components of a Flexible Circuit

A flexible circuit consists of copper foil, dielectric substrate+ coverlay and adhesive.

 

Copper foil is available in two different types of copper: ED Copper and RA copper.

ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper foil used for rigid printed circuit boards. This also means that the copper is “treated”, i.e., it has a slightly rough surface on one side, which ensures a better adhesion when the copper foil is bonded to the base material.

RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.

Copper foil is available in thickness of 12, 18, 35 and 70 μm.

 

The most common available for dielectric substrate and coverlay is polyimide films. This material can also be used as coverlay. Polyimide is best suited for flexible circuits because of its characteristics as stated below:

High temperature resistance allows soldering operations without damaging the flexible circuits

Very good electrical properties

Good chemical resistance

Polyimide is available in thicknesses of 12.5, 20, 25 and 50 μm.

 

Base laminates for rigid printed circuit boards are copper foils laminated together with the base materials, the adhesive coming from the prepreg material during lamination. Contrary to this is the flexible circuit where the lamination of the copper foil to the film material is achieved by means of an adhesive system. It is necessary to distinguish between two main systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated partly by the processing, and partly by the application of the finished flexible circuit.

크기를 줄이는 폴리이미드 경화제 2 항공 회사 코드 구리 4 층 플렉스 PCB 2크기를 줄이는 폴리이미드 경화제 2 항공 회사 코드 구리 4 층 플렉스 PCB 3
 
권장 제품
상품
제품 세부 정보
크기를 줄이는 폴리이미드 경화제 2 항공 회사 코드 구리 4 층 플렉스 PCB
모크: 1 PC
가격: USD9.99-99.99
표준 포장: 진공 bags+Cartons
배달 기간: 8-9 작업 일
지불 방법: 전신환
공급 능력: 달 당 5000 PC
자세한 정보
원래 장소
중국
브랜드 이름
Bicheng
인증
UL, ISO9001, IATF16949
모델 번호
BIC-268.V1.0
기재:
Polyimide
레이어 총수:
4개의 층
Pcb 간격:
0.25mm
PCB 사이즈:
50.22 X 122.17 밀리미터
커버레이:
노랑
실크 스트린:
백색
구리 중량:
70 um
표면가공도:
침수 금
최소 주문 수량:
1 PC
가격:
USD9.99-99.99
포장 세부 사항:
진공 bags+Cartons
배달 시간:
8-9 작업 일
지불 조건:
전신환
공급 능력:
달 당 5000 PC
강조하다

폴리이미드 경화제 4 층 플렉스 PCB

,

2 항공 회사 코드는 4 층 플렉스 PCB를 구리도금합니다

,

폴리이미드 경화제 2 항공 회사 코드 구리 PCB

제품 설명
 

4 Layer Flexible PCB Built on Polyimide with 2 oz Copper and Immersion Gold plus Keypads for Mobile Devices

(FPC’s are custom-made products, the picture and parameters shown are just for reference)

 

General description

This is a type of 4 layer flexible printed circuit for the application of Electronic Counter. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. Polyimide stiffener is applied on the inserting part.

 

Parameter and data sheet

Size of Flexible PCB 50.22 X 122.17mm
Number of Layers 4
Board Type Flexible PCB
Board Thickness 0.25mm
Board Material Poyimide 25µm
Board Material Supplier ITEQ
Tg Value of Board Material 60℃
 
PTH Cu thickness ≥20 µm
Inner Iayer Cu thicknes N/A
Surface Cu thickness 70 µm
   
Coverlay Colour Yellow
Number of Coverlay 1
Thickness of Coverlay 25 µm
Stiffener Material Polyimide
Stiffener Thickness 0.2mm
   
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
 
Peeling test of Coverlay No peelable
Legend Adhesion 3M 90℃ No peeling after Min. 3 times test
 
Surface Finish Immersion Gold
Thickness of Nickle/Gold Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required Yes
Famability 94-V0
 
Thermal Shock Test Pass, -25℃±125℃, 1000 cycles.
Thermal Stress Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2

 

크기를 줄이는 폴리이미드 경화제 2 항공 회사 코드 구리 4 층 플렉스 PCB 0

크기를 줄이는 폴리이미드 경화제 2 항공 회사 코드 구리 4 층 플렉스 PCB 1

 

Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

Material optionality

Low cost

Continuity of processing

Diversified shipping method

Eligible products rate of first production: >95%

 

Applications

LCD module, mobile phone antenna flex board, consumer card reader soft board

 

Components of a Flexible Circuit

A flexible circuit consists of copper foil, dielectric substrate+ coverlay and adhesive.

 

Copper foil is available in two different types of copper: ED Copper and RA copper.

ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper foil used for rigid printed circuit boards. This also means that the copper is “treated”, i.e., it has a slightly rough surface on one side, which ensures a better adhesion when the copper foil is bonded to the base material.

RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.

Copper foil is available in thickness of 12, 18, 35 and 70 μm.

 

The most common available for dielectric substrate and coverlay is polyimide films. This material can also be used as coverlay. Polyimide is best suited for flexible circuits because of its characteristics as stated below:

High temperature resistance allows soldering operations without damaging the flexible circuits

Very good electrical properties

Good chemical resistance

Polyimide is available in thicknesses of 12.5, 20, 25 and 50 μm.

 

Base laminates for rigid printed circuit boards are copper foils laminated together with the base materials, the adhesive coming from the prepreg material during lamination. Contrary to this is the flexible circuit where the lamination of the copper foil to the film material is achieved by means of an adhesive system. It is necessary to distinguish between two main systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated partly by the processing, and partly by the application of the finished flexible circuit.

크기를 줄이는 폴리이미드 경화제 2 항공 회사 코드 구리 4 층 플렉스 PCB 2크기를 줄이는 폴리이미드 경화제 2 항공 회사 코드 구리 4 층 플렉스 PCB 3
 
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