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4 층 연성 인쇄 회로 FPC는 검은 복면과 폴리이미드를 토대로 했습니다

4 층 연성 인쇄 회로 FPC는 검은 복면과 폴리이미드를 토대로 했습니다

모크: 1 PC
가격: USD9.99-99.99
표준 포장: 진공 bags+Cartons
배달 기간: 8-9 작업 일
지불 방법: 전신환
공급 능력: 달 당 5000 PC
자세한 정보
원래 장소
중국
브랜드 이름
Bicheng
인증
UL, ISO9001, IATF16949
모델 번호
BIC-283.V1.0
기재:
Polyimide
레이어 총수:
4개의 층
Pcb 간격:
0.3mm
PCB 사이즈:
70.18 X 40.28 밀리미터
커버레이:
검정색
실크 스트린:
백색
구리 중량:
1OZ
표면가공도:
침수 금
강조하다:

Black Mask Flexible PCB Board

,

0.3mm Flexible PCB Board

,

0.3mm 4 Layer PCB

제품 설명
 

4 Layer Flexible Printed Circuit (FPC) Built On Polyimide With Black Mask and Immersion Gold for Consumer Game Consoles

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

 

General description

This is a type of flexible printed circuit for the application of PLC Programing It’s a 4 layer FPC at 0.3mm thick. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. Polyimide stiffener is applied on the inserting part.

 

Parameter and data sheet

Size of Flexible PCB 70.18 X 40.28mm
Number of Layers 4
Board Type Flexible PCB
Board Thickness 0.30mm
Board Material Polyimide 25µm
Board Material Supplier ITEQ
Tg Value of Board Material 60
 
PTH Cu thickness 20 µm
Inner Iayer Cu thicknes N/A
Surface Cu thickness 35 µm
   
Coverlay Colour Black
Number of Coverlay 2
Thickness of Coverlay 25 µm
Stiffener Material Polyimide
Stiffener Thickness 0.2mm
   
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
 
Peeling test of Coverlay No peelable
Legend Adhesion 3M 90 No peeling after Min. 3 times test
 
Surface Finish Immersion Gold
Thickness of Nickle/Gold Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required Yes
Famability 94-V0
 
Thermal Shock Test Pass, -25±125, 1000 cycles.
Thermal Stress Pass, 300±5,10 seconds, 3 cycles. No delamination, no blistering.
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2

 

4 층 연성 인쇄 회로 FPC는 검은 복면과 폴리이미드를 토대로 했습니다 0

4 층 연성 인쇄 회로 FPC는 검은 복면과 폴리이미드를 토대로 했습니다 1

 

Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

The end can be whole soldered

Low cost

Continuity of processing

Focus on low to medium volume production

Make delivery on time. We keep higher than 98% on-time-delivery rate.

 

Applications

Keypad FPC, FFC for industrial control equipment, consumer game consoles

 

Structure of FPC

According to the number of layers of conductive copper foil, FPC can be divided into single layer circuit, double layer circuit, multi-layer circuit, double sided and so on.

 

Single-layer structure: the flexible circuit of this structure is the simplest structure of the flexible PCB. Usually the base material (dielectric substrates) + transparent rubber(adhesive) + copper foil is a set of purchased raw materials(semi-manufactures), the protective film and transparent glue are another kind of bought raw material. First, copper foil must be etched to obtain the required circuit, and the protective film should be drilled to reveal the corresponding pad. After cleaning, the two are combined by rolling. Then the exposed part of the pad electroplated gold or tin to protect. In this way, the big panel board will be ready. Generally also it’s stamped into the corresponding shape of the small circuit board. There is also no protective film directly on the copper foil, but printed resistance soldering coating, so that the cost will be lower, but the mechanical strength of the circuit board will become worse. Unless the strength requirement is not high and the price needs to be as low as possible, it is best to apply the protective film method.

 

Double layer structure: when the circuit is too complex to be wired, or copper foil is needed to shield the ground, it is necessary to choose a double layer or even a multilayer. The most typical difference between a multilayer and a single plate is the addition of a perforated structure to connect the layers of copper foil. The first process of transparent rubber + base material + copper foil is to make holes. Drill holes in the base material and copper foil first, clean and then plated with a certain thickness of copper. The subsequent fabrication process is almost the same as the single-layer circuit.

 

Double sided structure: both sides of the double sided FPC have pads, mainly used to connect other circuit boards. Although it and monolayer structure is similar, but the manufacturing process is very different. Its raw material is copper foil, protective film and transparent glue. The protective film should be drilled according to the position of the pad first, then the copper foil should be affixed, the pad and track lines should be etched and then the protective film of another drilled hole should be affixed.

 
4 층 연성 인쇄 회로 FPC는 검은 복면과 폴리이미드를 토대로 했습니다 2
4 층 연성 인쇄 회로 FPC는 검은 복면과 폴리이미드를 토대로 했습니다 3
 
권장 제품
상품
제품 세부 정보
4 층 연성 인쇄 회로 FPC는 검은 복면과 폴리이미드를 토대로 했습니다
모크: 1 PC
가격: USD9.99-99.99
표준 포장: 진공 bags+Cartons
배달 기간: 8-9 작업 일
지불 방법: 전신환
공급 능력: 달 당 5000 PC
자세한 정보
원래 장소
중국
브랜드 이름
Bicheng
인증
UL, ISO9001, IATF16949
모델 번호
BIC-283.V1.0
기재:
Polyimide
레이어 총수:
4개의 층
Pcb 간격:
0.3mm
PCB 사이즈:
70.18 X 40.28 밀리미터
커버레이:
검정색
실크 스트린:
백색
구리 중량:
1OZ
표면가공도:
침수 금
최소 주문 수량:
1 PC
가격:
USD9.99-99.99
포장 세부 사항:
진공 bags+Cartons
배달 시간:
8-9 작업 일
지불 조건:
전신환
공급 능력:
달 당 5000 PC
강조하다

Black Mask Flexible PCB Board

,

0.3mm Flexible PCB Board

,

0.3mm 4 Layer PCB

제품 설명
 

4 Layer Flexible Printed Circuit (FPC) Built On Polyimide With Black Mask and Immersion Gold for Consumer Game Consoles

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

 

General description

This is a type of flexible printed circuit for the application of PLC Programing It’s a 4 layer FPC at 0.3mm thick. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. Polyimide stiffener is applied on the inserting part.

 

Parameter and data sheet

Size of Flexible PCB 70.18 X 40.28mm
Number of Layers 4
Board Type Flexible PCB
Board Thickness 0.30mm
Board Material Polyimide 25µm
Board Material Supplier ITEQ
Tg Value of Board Material 60
 
PTH Cu thickness 20 µm
Inner Iayer Cu thicknes N/A
Surface Cu thickness 35 µm
   
Coverlay Colour Black
Number of Coverlay 2
Thickness of Coverlay 25 µm
Stiffener Material Polyimide
Stiffener Thickness 0.2mm
   
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
 
Peeling test of Coverlay No peelable
Legend Adhesion 3M 90 No peeling after Min. 3 times test
 
Surface Finish Immersion Gold
Thickness of Nickle/Gold Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required Yes
Famability 94-V0
 
Thermal Shock Test Pass, -25±125, 1000 cycles.
Thermal Stress Pass, 300±5,10 seconds, 3 cycles. No delamination, no blistering.
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2

 

4 층 연성 인쇄 회로 FPC는 검은 복면과 폴리이미드를 토대로 했습니다 0

4 층 연성 인쇄 회로 FPC는 검은 복면과 폴리이미드를 토대로 했습니다 1

 

Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

The end can be whole soldered

Low cost

Continuity of processing

Focus on low to medium volume production

Make delivery on time. We keep higher than 98% on-time-delivery rate.

 

Applications

Keypad FPC, FFC for industrial control equipment, consumer game consoles

 

Structure of FPC

According to the number of layers of conductive copper foil, FPC can be divided into single layer circuit, double layer circuit, multi-layer circuit, double sided and so on.

 

Single-layer structure: the flexible circuit of this structure is the simplest structure of the flexible PCB. Usually the base material (dielectric substrates) + transparent rubber(adhesive) + copper foil is a set of purchased raw materials(semi-manufactures), the protective film and transparent glue are another kind of bought raw material. First, copper foil must be etched to obtain the required circuit, and the protective film should be drilled to reveal the corresponding pad. After cleaning, the two are combined by rolling. Then the exposed part of the pad electroplated gold or tin to protect. In this way, the big panel board will be ready. Generally also it’s stamped into the corresponding shape of the small circuit board. There is also no protective film directly on the copper foil, but printed resistance soldering coating, so that the cost will be lower, but the mechanical strength of the circuit board will become worse. Unless the strength requirement is not high and the price needs to be as low as possible, it is best to apply the protective film method.

 

Double layer structure: when the circuit is too complex to be wired, or copper foil is needed to shield the ground, it is necessary to choose a double layer or even a multilayer. The most typical difference between a multilayer and a single plate is the addition of a perforated structure to connect the layers of copper foil. The first process of transparent rubber + base material + copper foil is to make holes. Drill holes in the base material and copper foil first, clean and then plated with a certain thickness of copper. The subsequent fabrication process is almost the same as the single-layer circuit.

 

Double sided structure: both sides of the double sided FPC have pads, mainly used to connect other circuit boards. Although it and monolayer structure is similar, but the manufacturing process is very different. Its raw material is copper foil, protective film and transparent glue. The protective film should be drilled according to the position of the pad first, then the copper foil should be affixed, the pad and track lines should be etched and then the protective film of another drilled hole should be affixed.

 
4 층 연성 인쇄 회로 FPC는 검은 복면과 폴리이미드를 토대로 했습니다 2
4 층 연성 인쇄 회로 FPC는 검은 복면과 폴리이미드를 토대로 했습니다 3
 
사이트맵 |  개인정보 보호 정책 | 중국 좋은 품질 타코닉 PCB 공급자. 저작권 2020-2025 Bicheng Electronics Technology Co., Ltd 모두 모든 권리 보호