모크: | 1pcs |
가격: | USD9.99-99.99 |
표준 포장: | 진공 백+상자 |
배달 기간: | 8-9 근무일 |
지불 방법: | t/t |
공급 능력: | 한 달에 5000pc |
Parameter | Specification |
---|---|
Layer Count | 2-layer |
Board Dimensions | 49mm x 27mm = 1PCS |
Minimum Trace/Space | 4/5 mils, enabling precise routing in compact designs without compromising signal integrity |
Minimum Hole Size | 0.2mm, accommodating small components for space-efficient layouts |
Finished Thickness | 0.2mm, ultra-thin design suitable for applications with strict space constraints |
Outer Cu Weight | 1oz (1.4 mils), ensuring reliable conductivity for various current requirements |
Via Plating | 20μm thick, enhancing interlayer connection durability against thermal and mechanical stress |
Surface Finish | ENIG (Electroless Nickel and Immersion Gold), providing superior corrosion resistance and consistent solderability |
Silkscreen | White on top (clear component identification), none on bottom (simplified design) |
Solder Mask | None on top or bottom, tailored for specific application needs |
Electrical Test | 100% tested before shipment (checks for shorts, opens, and impedance) to ensure functionality |
Layer | Material/Component | Thickness |
---|---|---|
Copper_layer_1 | Copper | 35μm |
Substrate | Rogers RO3010 | 5mil (0.127mm) |
Copper_layer_2 | Copper | 35μm |
모크: | 1pcs |
가격: | USD9.99-99.99 |
표준 포장: | 진공 백+상자 |
배달 기간: | 8-9 근무일 |
지불 방법: | t/t |
공급 능력: | 한 달에 5000pc |
Parameter | Specification |
---|---|
Layer Count | 2-layer |
Board Dimensions | 49mm x 27mm = 1PCS |
Minimum Trace/Space | 4/5 mils, enabling precise routing in compact designs without compromising signal integrity |
Minimum Hole Size | 0.2mm, accommodating small components for space-efficient layouts |
Finished Thickness | 0.2mm, ultra-thin design suitable for applications with strict space constraints |
Outer Cu Weight | 1oz (1.4 mils), ensuring reliable conductivity for various current requirements |
Via Plating | 20μm thick, enhancing interlayer connection durability against thermal and mechanical stress |
Surface Finish | ENIG (Electroless Nickel and Immersion Gold), providing superior corrosion resistance and consistent solderability |
Silkscreen | White on top (clear component identification), none on bottom (simplified design) |
Solder Mask | None on top or bottom, tailored for specific application needs |
Electrical Test | 100% tested before shipment (checks for shorts, opens, and impedance) to ensure functionality |
Layer | Material/Component | Thickness |
---|---|---|
Copper_layer_1 | Copper | 35μm |
Substrate | Rogers RO3010 | 5mil (0.127mm) |
Copper_layer_2 | Copper | 35μm |