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제품 소개타코닉 PCB

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish

인증
중국 Bicheng Electronics Technology Co., Ltd 인증
중국 Bicheng Electronics Technology Co., Ltd 인증
고객 검토
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— 부유한 리켓

루스, 나는 오늘 PCB를 얻었고 그들이 단지 완벽합니다. 약간의 인내를 멈추게 하시오 그러면 내 다음 명령은 곧 다가오고 있습니다. 종류는 함부르크로부터 주목합니다 올라프

—— 올라프 쿤홀드

하와이 나탈리. 그것은 완벽했습니다, 내가 참고를 위해 약간의 사진을 첨부합니다. 그리고 나는 예산에 당신에게 다음 2 사업을 보냅니다. 다시 대단히 감사합니다

—— 세바스챤 탑리제크

케빈, 감사, 그들이 완전히 만들어졌고, 잘 작동합니다. 약속된 대로 당신이 나를 위해 제조한 PCB를 사용하는 내 최근의 프로젝트를 위한 링크가 여기 있습니다 : 관계, 다니엘

—— 다니엘 포드

제가 지금 온라인 채팅 해요

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish
50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish

큰 이미지 :  50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish

제품 상세 정보:
원래 장소: 중국
브랜드 이름: Bicheng
인증: UL, ISO9001, IATF16949
모델 번호: BIC-052.V1.0
결제 및 배송 조건:
최소 주문 수량: 1pcs
가격: USD9.99-99.99
포장 세부 사항: 진공 백+상자
배달 시간: 8-9 근무일
지불 조건: t/t
공급 능력: 한 달에 5000pc

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish

설명
기본 자료: 타코닉 TLX-9 레이어 수: 2 층
PCB 두께: 1.35mm PCB 크기: 57mm x 136mm (공차: ±0.15mm)
구리 중량: 외부 레이어: 1온스(1.4밀) 표면 마감: 침지 주석
강조하다:

Taconic TLX-9 RF PCB

,

2-layer immersion tin PCB

,

50mil Taconic PCB board

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish

This 2-layer rigid PCB is crafted from Taconic TLX-9, a PTFE/woven glass laminate. This material is highly valued for its exceptional electrical and mechanical stability, making it a top choice for applications where consistent performance and reliability are critical.

 

1. PCB Specifications

This 2-layer rigid PCB is meticulously crafted with specifications optimized for precision and performance:

Parameter Specification
Base Material Taconic TLX-9 (PTFE/woven glass composite)
Layer Configuration 2 outer layers (no blind vias)
Dimensions 57mm x 136mm per unit (tolerance: ±0.15mm)
Trace/Space Minimum 6/6 mils (ensuring signal integrity in dense layouts)
Minimum Hole Size 0.3mm (supports compact component mounting)
Finished Thickness 1.35mm (balanced rigidity and versatility)
Copper Weight 1oz (1.4 mils) on outer layers (35μm per copper layer)
Via Plating 20μm thickness (enhances conductivity and durability)
Surface Finish Immersion tin (corrosion resistance and solderability)
Silkscreen & Solder Mask White top silkscreen (for component identification); no bottom silkscreen or solder mask (optimized for specific mounting needs)
Quality Assurance Printed series numbers for traceability + 100% electrical testing prior to shipment (eliminates defects in critical applications)

 

2. PCB Stack-up

Layer/Component Specification
Copper Layer 1 35μm
Taconic TLX-9 Core 1.27mm (50mil)
Copper Layer 2 35μm

 

3. Artwork & Quality Standards

Artwork Format: Gerber RS-274-X (industry-standard format for PCB fabrication)

 

Quality Certification: IPC-Class-2 (meets rigorous acceptability criteria)

 

Global Availability: Supplied worldwide to support international project requirements

 

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish 0

 

4. TLX-9 Material: Overview & Key Properties

Taconic TLX-9 is a PTFE/woven glass laminate engineered for precision electronics, offering exceptional processability (shearing, drilling, milling, plating) using standard PTFE fabrication methods. Its dimensional stability and near-zero moisture absorption (<0.02%) during manufacturing make it ideal for high-reliability applications. Below are its critical technical properties (measured at 10 GHz unless noted):

Property Specification
Dielectric Constant (DK) 2.5 (tightly controlled across frequency/temperature)
Dissipation Factor (DF) 0.0019
Moisture Absorption <0.02%
Dielectric Breakdown >60 kV
Volume Resistivity 10⁷ Mohm/cm
Surface Resistivity 10⁷ Mohm
Arc Resistance >180 seconds
Flexural Strength (Lengthwise) >23,000 lbs./in.
Flexural Strength (Crosswise) >19,000 lbs./in.
Peel Strength (1oz copper) 12 lbs./linear in.
Thermal Conductivity 0.19 W/m/K
x-y CTE 9-12 ppm/°C
z CTE 130-145 ppm/°C
UL-94 Flammability Rating V-0 (flame-retardant)

 

5. Core Benefits of TLX-9 PCB

This PCB leverages TLX-9’s inherent advantages to deliver superior performance:

 

Low Dielectric Constant (2.5): Minimizes signal loss and crosstalk in high-frequency applications.

 

Low Dissipation Factor (0.0019): Ensures efficient power transfer with minimal energy waste.

 

Near-Zero Moisture Absorption: Prevents performance degradation from environmental humidity.

 

High Dielectric Breakdown (>60 kV): Supports high-voltage operation without insulation failure.

 

Strong Peel Strength (12 lbs./linear in.): Enhances bond reliability between copper layers and substrate.

 

Controlled CTE: Matches thermal expansion of components (x-y CTE: 9-12 ppm/°C), reducing stress during temperature cycling.

 

6. Typical Applications

The combination of TLX-9’s properties and the PCB’s precision construction makes it ideal for:

 

-Low-Noise Amplifiers (LNAs), Low-Noise Blocks (LNBs), and Low-Noise Converters (LNCs)

 

-Personal Communications Service (PCS)/Personal Communications Network (PCN) systems

 

-Large Format Antennas

 

-High Power Amplifiers

 

-Passive Components (resistors, capacitors, inductors) for high-frequency circuits

 

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish 1

연락처 세부 사항
Bicheng Electronics Technology Co., Ltd

담당자: Ms. Ivy Deng

전화 번호: 86-755-27374946

팩스: 86-755-27374848

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