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| 모크: | 1pcs |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 백+상자 |
| 배달 기간: | 8-9 근무일 |
| 지불 방법: | t/t |
| 공급 능력: | 한 달에 5000pc |
This 2-layer rigid PCB is crafted from Taconic TLX-9, a PTFE/woven glass laminate. This material is highly valued for its exceptional electrical and mechanical stability, making it a top choice for applications where consistent performance and reliability are critical.
1. PCB Specifications
This 2-layer rigid PCB is meticulously crafted with specifications optimized for precision and performance:
| Parameter | Specification |
| Base Material | Taconic TLX-9 (PTFE/woven glass composite) |
| Layer Configuration | 2 outer layers (no blind vias) |
| Dimensions | 57mm x 136mm per unit (tolerance: ±0.15mm) |
| Trace/Space | Minimum 6/6 mils (ensuring signal integrity in dense layouts) |
| Minimum Hole Size | 0.3mm (supports compact component mounting) |
| Finished Thickness | 1.35mm (balanced rigidity and versatility) |
| Copper Weight | 1oz (1.4 mils) on outer layers (35μm per copper layer) |
| Via Plating | 20μm thickness (enhances conductivity and durability) |
| Surface Finish | Immersion tin (corrosion resistance and solderability) |
| Silkscreen & Solder Mask | White top silkscreen (for component identification); no bottom silkscreen or solder mask (optimized for specific mounting needs) |
| Quality Assurance | Printed series numbers for traceability + 100% electrical testing prior to shipment (eliminates defects in critical applications) |
2. PCB Stack-up
| Layer/Component | Specification |
| Copper Layer 1 | 35μm |
| Taconic TLX-9 Core | 1.27mm (50mil) |
| Copper Layer 2 | 35μm |
3. Artwork & Quality Standards
Artwork Format: Gerber RS-274-X (industry-standard format for PCB fabrication)
Quality Certification: IPC-Class-2 (meets rigorous acceptability criteria)
Global Availability: Supplied worldwide to support international project requirements
4. TLX-9 Material: Overview & Key Properties
Taconic TLX-9 is a PTFE/woven glass laminate engineered for precision electronics, offering exceptional processability (shearing, drilling, milling, plating) using standard PTFE fabrication methods. Its dimensional stability and near-zero moisture absorption (<0.02%) during manufacturing make it ideal for high-reliability applications. Below are its critical technical properties (measured at 10 GHz unless noted):
| Property | Specification |
| Dielectric Constant (DK) | 2.5 (tightly controlled across frequency/temperature) |
| Dissipation Factor (DF) | 0.0019 |
| Moisture Absorption | <0.02% |
| Dielectric Breakdown | >60 kV |
| Volume Resistivity | 10⁷ Mohm/cm |
| Surface Resistivity | 10⁷ Mohm |
| Arc Resistance | >180 seconds |
| Flexural Strength (Lengthwise) | >23,000 lbs./in. |
| Flexural Strength (Crosswise) | >19,000 lbs./in. |
| Peel Strength (1oz copper) | 12 lbs./linear in. |
| Thermal Conductivity | 0.19 W/m/K |
| x-y CTE | 9-12 ppm/°C |
| z CTE | 130-145 ppm/°C |
| UL-94 Flammability Rating | V-0 (flame-retardant) |
5. Core Benefits of TLX-9 PCB
This PCB leverages TLX-9’s inherent advantages to deliver superior performance:
Low Dielectric Constant (2.5): Minimizes signal loss and crosstalk in high-frequency applications.
Low Dissipation Factor (0.0019): Ensures efficient power transfer with minimal energy waste.
Near-Zero Moisture Absorption: Prevents performance degradation from environmental humidity.
High Dielectric Breakdown (>60 kV): Supports high-voltage operation without insulation failure.
Strong Peel Strength (12 lbs./linear in.): Enhances bond reliability between copper layers and substrate.
Controlled CTE: Matches thermal expansion of components (x-y CTE: 9-12 ppm/°C), reducing stress during temperature cycling.
6. Typical Applications
The combination of TLX-9’s properties and the PCB’s precision construction makes it ideal for:
-Low-Noise Amplifiers (LNAs), Low-Noise Blocks (LNBs), and Low-Noise Converters (LNCs)
-Personal Communications Service (PCS)/Personal Communications Network (PCN) systems
-Large Format Antennas
-High Power Amplifiers
-Passive Components (resistors, capacitors, inductors) for high-frequency circuits
|
|
| 모크: | 1pcs |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 백+상자 |
| 배달 기간: | 8-9 근무일 |
| 지불 방법: | t/t |
| 공급 능력: | 한 달에 5000pc |
This 2-layer rigid PCB is crafted from Taconic TLX-9, a PTFE/woven glass laminate. This material is highly valued for its exceptional electrical and mechanical stability, making it a top choice for applications where consistent performance and reliability are critical.
1. PCB Specifications
This 2-layer rigid PCB is meticulously crafted with specifications optimized for precision and performance:
| Parameter | Specification |
| Base Material | Taconic TLX-9 (PTFE/woven glass composite) |
| Layer Configuration | 2 outer layers (no blind vias) |
| Dimensions | 57mm x 136mm per unit (tolerance: ±0.15mm) |
| Trace/Space | Minimum 6/6 mils (ensuring signal integrity in dense layouts) |
| Minimum Hole Size | 0.3mm (supports compact component mounting) |
| Finished Thickness | 1.35mm (balanced rigidity and versatility) |
| Copper Weight | 1oz (1.4 mils) on outer layers (35μm per copper layer) |
| Via Plating | 20μm thickness (enhances conductivity and durability) |
| Surface Finish | Immersion tin (corrosion resistance and solderability) |
| Silkscreen & Solder Mask | White top silkscreen (for component identification); no bottom silkscreen or solder mask (optimized for specific mounting needs) |
| Quality Assurance | Printed series numbers for traceability + 100% electrical testing prior to shipment (eliminates defects in critical applications) |
2. PCB Stack-up
| Layer/Component | Specification |
| Copper Layer 1 | 35μm |
| Taconic TLX-9 Core | 1.27mm (50mil) |
| Copper Layer 2 | 35μm |
3. Artwork & Quality Standards
Artwork Format: Gerber RS-274-X (industry-standard format for PCB fabrication)
Quality Certification: IPC-Class-2 (meets rigorous acceptability criteria)
Global Availability: Supplied worldwide to support international project requirements
4. TLX-9 Material: Overview & Key Properties
Taconic TLX-9 is a PTFE/woven glass laminate engineered for precision electronics, offering exceptional processability (shearing, drilling, milling, plating) using standard PTFE fabrication methods. Its dimensional stability and near-zero moisture absorption (<0.02%) during manufacturing make it ideal for high-reliability applications. Below are its critical technical properties (measured at 10 GHz unless noted):
| Property | Specification |
| Dielectric Constant (DK) | 2.5 (tightly controlled across frequency/temperature) |
| Dissipation Factor (DF) | 0.0019 |
| Moisture Absorption | <0.02% |
| Dielectric Breakdown | >60 kV |
| Volume Resistivity | 10⁷ Mohm/cm |
| Surface Resistivity | 10⁷ Mohm |
| Arc Resistance | >180 seconds |
| Flexural Strength (Lengthwise) | >23,000 lbs./in. |
| Flexural Strength (Crosswise) | >19,000 lbs./in. |
| Peel Strength (1oz copper) | 12 lbs./linear in. |
| Thermal Conductivity | 0.19 W/m/K |
| x-y CTE | 9-12 ppm/°C |
| z CTE | 130-145 ppm/°C |
| UL-94 Flammability Rating | V-0 (flame-retardant) |
5. Core Benefits of TLX-9 PCB
This PCB leverages TLX-9’s inherent advantages to deliver superior performance:
Low Dielectric Constant (2.5): Minimizes signal loss and crosstalk in high-frequency applications.
Low Dissipation Factor (0.0019): Ensures efficient power transfer with minimal energy waste.
Near-Zero Moisture Absorption: Prevents performance degradation from environmental humidity.
High Dielectric Breakdown (>60 kV): Supports high-voltage operation without insulation failure.
Strong Peel Strength (12 lbs./linear in.): Enhances bond reliability between copper layers and substrate.
Controlled CTE: Matches thermal expansion of components (x-y CTE: 9-12 ppm/°C), reducing stress during temperature cycling.
6. Typical Applications
The combination of TLX-9’s properties and the PCB’s precision construction makes it ideal for:
-Low-Noise Amplifiers (LNAs), Low-Noise Blocks (LNBs), and Low-Noise Converters (LNCs)
-Personal Communications Service (PCS)/Personal Communications Network (PCN) systems
-Large Format Antennas
-High Power Amplifiers
-Passive Components (resistors, capacitors, inductors) for high-frequency circuits
