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제품 상세 정보:
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| 기본 자료: | 로저스 RO3006 | 레이어 수: | 2 층 |
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| PCB 두께: | 0.2mm | PCB 크기: | 20mm × 25mm |
| 구리 중량: | 1oz (1.4 mils 또는 35μm에 해당) | 표면 마감: | 순금 30u" |
| 강조하다: | Rogers PCB board 5mil double-sided,RO3006 PCB pure gold plating,double-sided PCB with 30u gold |
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This 2-layer rigid PCB is tailored for high-performance commercial microwave and RF applications, utilizing the superior electrical and mechanical stability of Rogers RO3006 ceramic-filled PTFE composite laminates. Thanks to its ultra-compact size, precise manufacturing specifications, and consistent performance across temperature changes, it's an optimal choice for space-limited and temperature-sensitive high-frequency electronic systems.
1. PCB Specifications
The PCB’s construction is optimized for precision, miniaturization, and compatibility with high-frequency operational demands, with key parameters outlined as follows:
| Parameter | Specification |
| Base Material | Rogers RO3006 (ceramic-filled PTFE composite laminate) |
| Layer Count | 2 layers (top and bottom outer copper layers) |
| Board Dimensions | 20mm × 25mm per unit (1PCS) |
| Minimum Trace/Space | 5 mils (trace width) / 9 mils (trace spacing) |
| Minimum Hole Size | 0.2mm; no blind vias supported |
| Finished Board Thickness | 0.2mm |
| Finished Copper Weight (Outer Layers) | 1oz (equivalent to 1.4 mils or 35μm) |
| Via Plating Thickness | 20μm |
| Surface Finish | Pure gold 30u" (specifically designed for wire bonding applications, ensuring excellent conductivity and bonding reliability) |
| Silkscreen | No |
| Solder Mask | No |
| Quality Assurance | 100% electrical testing conducted prior to shipment (effectively eliminating open/short circuit issues and ensuring operational reliability) |
2. PCB Stack-up Configuration
| Layer | Thickness | Function |
| Top Copper Layer (Copper_layer_1) | 35μm | Serves as the primary layer for high-frequency signal traces and top-side SMT pads, ensuring efficient signal transmission |
| Rogers RO3006 Substrate | 5 mils (0.127mm) | Acts as the dielectric core, providing exceptional electrical stability across temperature ranges to support reliable microwave and RF performance |
| Bottom Copper Layer (Copper_layer_2) | 35μm | Facilitates ground plane setup, additional signal routing, or thru-hole component connections, enhancing overall circuit functionality |
3. Quality Standards & Global Availability
Artwork Format: Gerber RS-274-X (the universal industry standard for PCB manufacturing)
Accepted Quality Standard: IPC-Class-2 (meets strict requirements for performance, durability, and consistency)
Availability: Globally accessible (support projects across different countries and regions)
4. Rogers RO3006 Substrate: Introduction, Features & Benefits
4.1 Introduction to Rogers RO3006
Rogers RO3006 laminates are high-performance ceramic-filled PTFE composites developed to deliver outstanding electrical and mechanical stability. A key advantage is their stable dielectric constant (Dk) across a wide temperature range, which eliminates the typical step change in Dk that affects standard PTFE glass materials near room temperature. This characteristic ensures consistent performance, making it a preferred choice for demanding microwave and RF systems.
4.2 Key Features of Rogers RO3006
| Property | Value | Significance |
| Material Composition | Ceramic-filled PTFE composite | Balances low signal loss with excellent mechanical strength |
| Dielectric Constant (Dk) | 6.15 ± 0.15 at 10 GHz / 23°C | Tight tolerance ensures predictable signal propagation and consistent performance |
| Dissipation Factor | 0.002 at 10 GHz / 23°C | Ultra-low signal loss critical for maintaining signal integrity in high-frequency applications |
| Decomposition Temperature (Td) | >500°C | High thermal resistance suitable for harsh high-temperature environments |
| Thermal Conductivity | 0.79 W/mK | Efficient heat dissipation protects sensitive components and prevents overheating |
| Moisture Absorption | 0.02% | Minimal water uptake ensures stable performance in humid conditions |
| Coefficient of Thermal Expansion (CTE) | X-axis 17 ppm/°C, Y-axis 17 ppm/°C, Z-axis 24 ppm/°C (measured from -55°C to 288°C) | Low in-plane expansion matches copper, reducing thermal stress on PCB and components |
4.3 Core Benefits of Rogers RO3006
These features translate to tangible advantages for both circuit design and end-use performance:
Uniform Mechanical Properties Across Dielectric Constants: Compatible with a range of dielectric constants, making it ideal for multi-layer board designs and hybrid assemblies with epoxy glass multi-layer boards, enhancing design flexibility
Low In-Plane Expansion Coefficient (Copper-Matched): Matches the expansion coefficient of copper, enabling more reliable surface-mounted assemblies, suitable for temperature-sensitive applications, and ensuring excellent dimensional stability over temperature variations
Volume Manufacturing Compatibility: Supports high-volume production processes with economical laminate pricing, reducing overall production costs while maintaining high quality
5. Some Typical Applications
- Automotive radar applications
- Global positioning satellite antennas
- Cellular telecommunications systems - power amplifiers and antennas
- Patch antenna for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
In short, this 2-layer Rogers RO3006 PCB features precise manufacturing, compliant quality, and a high-performance substrate, offering a cost-efficient and reliable solution for commercial microwave and RF applications. With its compact design, low signal loss, and temperature stability, it's ideal for next-gen high-frequency electronics development.
담당자: Ms. Ivy Deng
전화 번호: 86-755-27374946
팩스: 86-755-27374848
Korean
