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Rogers RO3010 PCB 25mil Thick Double-layer pcb Board

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금속 코어 PCB

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Ms. Ivy Deng

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86-755-27374847

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Rogers RO3010 PCB 25mil Thick Double-layer pcb Board

모크:	1개
가격:	USD9.99-99.99
표준 포장:	진공 백+상자
배달 기간:	8-9 근무일
지불 방법:	티/티
공급 능력:	한 달에 5000pc

세부 정보 정보

제품 설명

자세한 정보

원래 장소

브랜드 이름

Bicheng

UL, ISO9001, IATF16949

모델 번호

BIC-332.V1.0

기본 자료:

RO3010을 성교합니다

레이어 수:

PCB 두께:

0.8mm

PCB 크기:

45mm x 65mm (1개)

실크 스크린:

솔더 마스크:

구리 중량:

외부 레이어용 1온스(1.4밀)

표면 마무리:

강조하다:

Rogers RO3010 PCB board

double-layer PCB board 25mil

Rogers high-frequency PCB

제품 설명

Rogers RO3010 PCB 25mil Thick Double-layer pcb Board

Crafted for precision and reliability, this 2-layer rigid PCB leverages Rogers RO3010--a ceramic-filled PTFE composite material--to deliver exceptional high-frequency performance, dimensional stability, and circuit miniaturization.

PCB Specification

Parameter	Specification
Layer Count	2-layer rigid PCB
Base Material	Rogers RO3010 (ceramic-filled PTFE composite)
Board Dimensions	45mm x 65mm (1 piece)
Finished Board Thickness	0.8mm
Finished Copper Weight (Outer Layers)	1oz (1.4 mils / 35μm)
Via Plating Thickness	20μm
Minimum Trace/Space	4 mils / 4 mils
Minimum Hole Size	0.3mm
Vias	12 total (no blind vias)
Surface Finish	Immersion Gold
Silkscreen	Top: Black; Bottom: No
Solder Mask	Top: No; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

PCB Stack-up (Top to Bottom)

Layer Sequence	Layer Type	Specification	Thickness
1	Copper Layer (Top - L1)	Copper_layer_1	35μm (1oz)
2	Substrate	Rogers RO3010	0.635mm (25mil)
3	Copper Layer (Bottom - L2)	Copper_layer_2	35μm (1oz)

Rogers RO3010 Material Overview

Rogers RO3010 is an advanced circuit material categorized as a ceramic-filled PTFE composite, designed to deliver a high dielectric constant (Dk) with exceptional stability across broad frequencies and environmental conditions. As a competitively priced solution, it combines superior mechanical and electrical performance, simplifying the design of broadband components while enabling circuit miniaturization-- a key advantage for space-constrained applications. Its consistent characteristics make it suitable for a wide range of high-frequency use cases, from automotive radar to satellite communications, while supporting volume manufacturing with cost-effective pricing.

Key Features of Rogers RO3010

Property	Specification
Dielectric Constant (Dk)	10.2 ±0.30 (10GHz/23°C)
Dissipation Factor (Df)	0.0022 (10GHz/23°C)
Coefficient of Thermal Expansion (CTE)	X-axis: 13 ppm/°C; Y-axis: 11 ppm/°C; Z-axis: 16 ppm/°C (-55°C to 288°C)
Thermal Decomposition Temperature (Td)	>500°C
Thermal Conductivity	0.95 W/mK
Moisture Absorption	0.05%
Operating Temperature Range	-40°C to +85°C
Quality Certification	ISO 9001 Certified

Core Benefits of Rogers RO3010

Dimensional Stability: CTE closely matched to copper, ensuring minimal warpage or layer separation during thermal cycling and processing.
Cost-Effective Volume Production: Economical laminate pricing makes it ideal for high-volume manufacturing without compromising performance.
Broadband Compatibility: Exceptional electrical and mechanical stability across a wide frequency range, simplifying broadband component design.
Circuit Miniaturization: High Dk enables smaller circuit footprints, supporting space-efficient designs for compact devices.
Multi-Layer Versatility: Suitable for multi-layer board designs, offering flexibility for complex circuit architectures.

Typical Applications

This 2-layer RO3010 PCB is tailored for high-frequency, high-reliability systems across industries:

Automotive radar applications (e.g., adaptive cruise control, collision avoidance)
Global Positioning System (GPS) antennas
Cellular telecommunications systems (power amplifiers, antennas)
Patch antennas for wireless communications
Direct broadcast satellite (DBS) equipment
Cable system datalinks
Remote meter readers
Power backplanes

Compliant with IPC-Class-2 standards and available globally, it is engineered to meet the demands of automotive, telecommunications, and satellite systems, where a high dielectric constant (Dk) and low loss are non-negotiable.

태그:

상품

모크:	1개
가격:	USD9.99-99.99
표준 포장:	진공 백+상자
배달 기간:	8-9 근무일
지불 방법:	티/티
공급 능력:	한 달에 5000pc

자세한 정보

제품 설명

자세한 정보

원래 장소

중국

브랜드 이름

Bicheng

인증

UL, ISO9001, IATF16949

모델 번호

BIC-332.V1.0

기본 자료:

RO3010을 성교합니다

레이어 수:

2 층

PCB 두께:

0.8mm

PCB 크기:

45mm x 65mm (1개)

실크 스크린:

검은색

솔더 마스크:

아니요

구리 중량:

외부 레이어용 1온스(1.4밀)

표면 마무리:

몰입 금

최소 주문 수량:

1개

가격:

USD9.99-99.99

포장 세부 사항:

진공 백+상자

배달 시간:

8-9 근무일

지불 조건:

티/티

공급 능력:

한 달에 5000pc

강조하다

Rogers RO3010 PCB board

double-layer PCB board 25mil

Rogers high-frequency PCB

제품 설명

Rogers RO3010 PCB 25mil Thick Double-layer pcb Board

PCB Specification

Parameter	Specification
Layer Count	2-layer rigid PCB
Base Material	Rogers RO3010 (ceramic-filled PTFE composite)
Board Dimensions	45mm x 65mm (1 piece)
Finished Board Thickness	0.8mm
Finished Copper Weight (Outer Layers)	1oz (1.4 mils / 35μm)
Via Plating Thickness	20μm
Minimum Trace/Space	4 mils / 4 mils
Minimum Hole Size	0.3mm
Vias	12 total (no blind vias)
Surface Finish	Immersion Gold
Silkscreen	Top: Black; Bottom: No
Solder Mask	Top: No; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

PCB Stack-up (Top to Bottom)

Layer Sequence	Layer Type	Specification	Thickness
1	Copper Layer (Top - L1)	Copper_layer_1	35μm (1oz)
2	Substrate	Rogers RO3010	0.635mm (25mil)
3	Copper Layer (Bottom - L2)	Copper_layer_2	35μm (1oz)

Rogers RO3010 Material Overview

Key Features of Rogers RO3010

Property	Specification
Dielectric Constant (Dk)	10.2 ±0.30 (10GHz/23°C)
Dissipation Factor (Df)	0.0022 (10GHz/23°C)
Coefficient of Thermal Expansion (CTE)	X-axis: 13 ppm/°C; Y-axis: 11 ppm/°C; Z-axis: 16 ppm/°C (-55°C to 288°C)
Thermal Decomposition Temperature (Td)	>500°C
Thermal Conductivity	0.95 W/mK
Moisture Absorption	0.05%
Operating Temperature Range	-40°C to +85°C
Quality Certification	ISO 9001 Certified

Core Benefits of Rogers RO3010

Dimensional Stability: CTE closely matched to copper, ensuring minimal warpage or layer separation during thermal cycling and processing.
Cost-Effective Volume Production: Economical laminate pricing makes it ideal for high-volume manufacturing without compromising performance.
Broadband Compatibility: Exceptional electrical and mechanical stability across a wide frequency range, simplifying broadband component design.
Circuit Miniaturization: High Dk enables smaller circuit footprints, supporting space-efficient designs for compact devices.
Multi-Layer Versatility: Suitable for multi-layer board designs, offering flexibility for complex circuit architectures.

Typical Applications

This 2-layer RO3010 PCB is tailored for high-frequency, high-reliability systems across industries:

Automotive radar applications (e.g., adaptive cruise control, collision avoidance)
Global Positioning System (GPS) antennas
Cellular telecommunications systems (power amplifiers, antennas)
Patch antennas for wireless communications
Direct broadcast satellite (DBS) equipment
Cable system datalinks
Remote meter readers
Power backplanes

태그:

타코닉 PCB

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가동 가능한 PCB 널

fr4 pcb 널

PCB (폴리염화비페닐) 스텐실

금속 코어 PCB

Rogers RO3010 PCB 25mil Thick Double-layer pcb Board

Rogers RO3010 PCB board

double-layer PCB board 25mil

Rogers high-frequency PCB

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

타코닉 PCB

Rogers PCB 널

PTFE PCB 보드

높은 Tg PCB

다층 PCB

타코닉 PCB

HDI PCB 널

고속 PCB

임피던스 제어 PCB

가동 가능한 PCB 널

fr4 pcb 널

PCB (폴리염화비페닐) 스텐실

금속 코어 PCB

Rogers RO3010 PCB board

double-layer PCB board 25mil

Rogers high-frequency PCB

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,