|
| 모크: | 1개 |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 가방 + 상자 |
| 배달 기간: | 8-9 영업일 |
| 지불 방법: | 티/티 |
| 공급 능력: | 달 당 5000PCS |
This PCB is a high-performance 6-layer board fabricated with FR408HR laminate. As a high-performance FR-4 resin system, FR408HR possesses excellent thermal, electrical, and mechanical properties, making it highly suitable for multilayer PCB applications that require maximum thermal performance and operational reliability.
PCB Specification
| Item | Specifications |
| Base Material | FR408HR Laminate |
| Layer Count | 6 layers (multilayer PCB) |
| Board Dimensions | 79mm x 105mm per unit, 1 piece total |
| Finished Board Thickness | 1.60mm (laminated thickness) |
| Finished Copper Weight | 1 oz per layer |
| Surface Finish | Immersion Gold |
| Top/Bottom Solder Mask | Blue solder mask with white silkscreen (top and bottom) |
| Additional Processing | Resin plugging for holes with diameter 0.2mm-0.4mm |
PCB Stack-up
| Layer No. | Description | Thickness |
| 1 | Copper Layer — L1 (Outer Top) | 0.035 mm |
| 2 | Prepreg FR408HR 2116 (58%) | Standard Prepreg Thickness |
| 3 | Prepreg FR408HR 2116 (58%) | Standard Prepreg Thickness |
| 4 | Copper Layer — L2 | 0.035 mm |
| 5 | Core FR408HR | 0.25 mm |
| 6 | Copper Layer — L3 | 0.035 mm |
| 7 | Prepreg FR408HR 2116 (58%) | Standard Prepreg Thickness |
| 8 | Prepreg FR408HR 2116 (58%) | Standard Prepreg Thickness |
| 9 | Copper Layer — L4 | 0.035 mm |
| 10 | Core FR408HR | 0.25 mm |
| 11 | Copper Layer — L5 | 0.035 mm |
| 12 | Prepreg FR408HR 2116 (58%) | Standard Prepreg Thickness |
| 13 | Prepreg FR408HR 2116 (58%) | Standard Prepreg Thickness |
| 14 | Copper Layer — L6 (Outer Bottom) | 0.035 mm |
| Total Pressed Thickness | 1.544 mm | |
Introduction to FR408HR Material
FR408HR laminate and prepreg products are manufactured with Isola’s patented high-performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 30% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties, coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective.
FR408HR Material Properties & Features
| Property | Typical Value | Units (Metric/English) | Test Method (IPC-TM-650 or as noted) |
| Glass Transition Temperature (Tg) by DSC | 190 | °C | 2.4.25C |
| Decomposition Temperature (Td) by TGA @ 5% weight loss | 360 | °C | 2.4.24.6 |
| Time to Delaminate by TMA (Copper removed) A. T260 B. T288 | 60 >30 | Minutes | 2.4.24.1 |
| Z-Axis CTE A. Pre-Tg B. Post-Tg C. 50 to 260°C (Total Expansion) | 55 230 2.8 | ppm/°C ppm/°C % | 2.4.24C |
| X/Y-Axis CTE (Pre-Tg) | 16 | ppm/°C | 2.4.24C |
| Thermal Conductivity | 0.4 | W/m·K | ASTM E1952 |
| Thermal Stress 10 sec @ 288ºC (550.4ºF) A. Unetched B. Etched | Pass | Pass Visual | 2.4.13.1 |
| Dk, Permittivity A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz | 3.72 3.69 3.68 3.64 3.65 | — | 2.5.5.3; 2.5.5.9; Bereskin Stripline |
| Df, Loss Tangent A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz | 0.0072 0.0091 0.0092 0.0098 0.0095 | — | 2.5.5.3; 2.5.5.9; Bereskin Stripline |
| Volume Resistivity A. After moisture resistance B. At elevated temperature | 4.4 x 10⁷ 9.4 x 10⁷ | MΩ-cm | 2.5.17.1 |
| Surface Resistivity A. After moisture resistance B. At elevated temperature | 2.6 x 10⁶ 2.1 x 10⁸ | MΩ | 2.5.17.1 |
| Dielectric Breakdown | >50 | kV | 2.5.6B |
| Arc Resistance | 137 | Seconds | 2.5.1B |
| Electric Strength (Laminate & laminated prepreg) | 70 (1741) | kV/mm (V/mil) | 2.5.6.2A |
| Comparative Tracking Index (CTI) | 2 (250-399) | Class (Volts) | UL 746A; ASTM D3638 |
| Peel Strength A. Low/very low profile copper foil (>17μm) B. Standard profile copper 1. After thermal stress 2. After process solutions | 1.14 (6.5) 0.96 (5.5) 0.90 (5.1) | N/mm (lb/inch) | 2.4.8C; 2.4.8.2A; 2.4.8.3 |
| Flexural Strength A. Length direction B. Cross direction | 72.5 58.0 | ksi | 2.4.4B |
| Tensile Strength A. Length direction B. Cross direction | 54.5 38.7 | ksi | ASTM D3039 |
| Young's Modulus A. Length direction B. Cross direction | 3695 3315 | ksi | ASTM D790-15e2 |
| Poisson's Ratio A. Length direction B. Cross direction | 0.137 0.133 | — | ASTM D3039 |
| Moisture Absorption | 0.061 | % | 2.6.2.1A |
| Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 |
| Relative Thermal Index (RTI) | 130 | °C | UL 796 |
Typical Applications of FR408HR PCB
-High-density 6-layer PCBs
-Lead-free assembly electronic products
-Devices requiring multiple reflow cycles (up to 6x 260°C)
-Equipment with 0.8mm pitch components and small-diameter holes
-Electronic systems demanding superior moisture resistance and structural stability
-Products compatible with AOI and optical positioning systems
Artwork, Quality Standard and Availability
This PCB's artwork is provided in the industry-standard Gerber RS-274-X format, compatible with mainstream production equipment and design software. It complies with recognized industry standards, ensuring consistent electrical performance, reliable manufacturing quality, and suitability for high-reliability applications. This PCB is available worldwide to meet the needs of international customers and high-performance circuit projects.
Conclusion
Due to FR408HR’s superior thermal stability, excellent electrical performance, CAF resistance, lead-free assembly compatibility, and FR-4 process adaptability, the 6-layer PCB has become the optimal choice for professionals and project teams engaged in high-density, high-reliability electronic projects that demand stable performance, precise processing, and long-term durability.
|
|
| 모크: | 1개 |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 가방 + 상자 |
| 배달 기간: | 8-9 영업일 |
| 지불 방법: | 티/티 |
| 공급 능력: | 달 당 5000PCS |
This PCB is a high-performance 6-layer board fabricated with FR408HR laminate. As a high-performance FR-4 resin system, FR408HR possesses excellent thermal, electrical, and mechanical properties, making it highly suitable for multilayer PCB applications that require maximum thermal performance and operational reliability.
PCB Specification
| Item | Specifications |
| Base Material | FR408HR Laminate |
| Layer Count | 6 layers (multilayer PCB) |
| Board Dimensions | 79mm x 105mm per unit, 1 piece total |
| Finished Board Thickness | 1.60mm (laminated thickness) |
| Finished Copper Weight | 1 oz per layer |
| Surface Finish | Immersion Gold |
| Top/Bottom Solder Mask | Blue solder mask with white silkscreen (top and bottom) |
| Additional Processing | Resin plugging for holes with diameter 0.2mm-0.4mm |
PCB Stack-up
| Layer No. | Description | Thickness |
| 1 | Copper Layer — L1 (Outer Top) | 0.035 mm |
| 2 | Prepreg FR408HR 2116 (58%) | Standard Prepreg Thickness |
| 3 | Prepreg FR408HR 2116 (58%) | Standard Prepreg Thickness |
| 4 | Copper Layer — L2 | 0.035 mm |
| 5 | Core FR408HR | 0.25 mm |
| 6 | Copper Layer — L3 | 0.035 mm |
| 7 | Prepreg FR408HR 2116 (58%) | Standard Prepreg Thickness |
| 8 | Prepreg FR408HR 2116 (58%) | Standard Prepreg Thickness |
| 9 | Copper Layer — L4 | 0.035 mm |
| 10 | Core FR408HR | 0.25 mm |
| 11 | Copper Layer — L5 | 0.035 mm |
| 12 | Prepreg FR408HR 2116 (58%) | Standard Prepreg Thickness |
| 13 | Prepreg FR408HR 2116 (58%) | Standard Prepreg Thickness |
| 14 | Copper Layer — L6 (Outer Bottom) | 0.035 mm |
| Total Pressed Thickness | 1.544 mm | |
Introduction to FR408HR Material
FR408HR laminate and prepreg products are manufactured with Isola’s patented high-performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 30% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties, coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective.
FR408HR Material Properties & Features
| Property | Typical Value | Units (Metric/English) | Test Method (IPC-TM-650 or as noted) |
| Glass Transition Temperature (Tg) by DSC | 190 | °C | 2.4.25C |
| Decomposition Temperature (Td) by TGA @ 5% weight loss | 360 | °C | 2.4.24.6 |
| Time to Delaminate by TMA (Copper removed) A. T260 B. T288 | 60 >30 | Minutes | 2.4.24.1 |
| Z-Axis CTE A. Pre-Tg B. Post-Tg C. 50 to 260°C (Total Expansion) | 55 230 2.8 | ppm/°C ppm/°C % | 2.4.24C |
| X/Y-Axis CTE (Pre-Tg) | 16 | ppm/°C | 2.4.24C |
| Thermal Conductivity | 0.4 | W/m·K | ASTM E1952 |
| Thermal Stress 10 sec @ 288ºC (550.4ºF) A. Unetched B. Etched | Pass | Pass Visual | 2.4.13.1 |
| Dk, Permittivity A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz | 3.72 3.69 3.68 3.64 3.65 | — | 2.5.5.3; 2.5.5.9; Bereskin Stripline |
| Df, Loss Tangent A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz | 0.0072 0.0091 0.0092 0.0098 0.0095 | — | 2.5.5.3; 2.5.5.9; Bereskin Stripline |
| Volume Resistivity A. After moisture resistance B. At elevated temperature | 4.4 x 10⁷ 9.4 x 10⁷ | MΩ-cm | 2.5.17.1 |
| Surface Resistivity A. After moisture resistance B. At elevated temperature | 2.6 x 10⁶ 2.1 x 10⁸ | MΩ | 2.5.17.1 |
| Dielectric Breakdown | >50 | kV | 2.5.6B |
| Arc Resistance | 137 | Seconds | 2.5.1B |
| Electric Strength (Laminate & laminated prepreg) | 70 (1741) | kV/mm (V/mil) | 2.5.6.2A |
| Comparative Tracking Index (CTI) | 2 (250-399) | Class (Volts) | UL 746A; ASTM D3638 |
| Peel Strength A. Low/very low profile copper foil (>17μm) B. Standard profile copper 1. After thermal stress 2. After process solutions | 1.14 (6.5) 0.96 (5.5) 0.90 (5.1) | N/mm (lb/inch) | 2.4.8C; 2.4.8.2A; 2.4.8.3 |
| Flexural Strength A. Length direction B. Cross direction | 72.5 58.0 | ksi | 2.4.4B |
| Tensile Strength A. Length direction B. Cross direction | 54.5 38.7 | ksi | ASTM D3039 |
| Young's Modulus A. Length direction B. Cross direction | 3695 3315 | ksi | ASTM D790-15e2 |
| Poisson's Ratio A. Length direction B. Cross direction | 0.137 0.133 | — | ASTM D3039 |
| Moisture Absorption | 0.061 | % | 2.6.2.1A |
| Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 |
| Relative Thermal Index (RTI) | 130 | °C | UL 796 |
Typical Applications of FR408HR PCB
-High-density 6-layer PCBs
-Lead-free assembly electronic products
-Devices requiring multiple reflow cycles (up to 6x 260°C)
-Equipment with 0.8mm pitch components and small-diameter holes
-Electronic systems demanding superior moisture resistance and structural stability
-Products compatible with AOI and optical positioning systems
Artwork, Quality Standard and Availability
This PCB's artwork is provided in the industry-standard Gerber RS-274-X format, compatible with mainstream production equipment and design software. It complies with recognized industry standards, ensuring consistent electrical performance, reliable manufacturing quality, and suitability for high-reliability applications. This PCB is available worldwide to meet the needs of international customers and high-performance circuit projects.
Conclusion
Due to FR408HR’s superior thermal stability, excellent electrical performance, CAF resistance, lead-free assembly compatibility, and FR-4 process adaptability, the 6-layer PCB has become the optimal choice for professionals and project teams engaged in high-density, high-reliability electronic projects that demand stable performance, precise processing, and long-term durability.
