|
| 모크: | 1개 |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 가방 + 상자 |
| 배달 기간: | 8-9 영업일 |
| 지불 방법: | 티/티 |
| 공급 능력: | 달 당 5000PCS |
RT/duroid 6202 is a high-frequency circuit material formulated as a low-loss, low-dielectric-constant laminate. It delivers superior electrical and mechanical properties essential for designing complex microwave structures that require both mechanical reliability and electrical stability.
The inclusion of limited woven glass reinforcement provides excellent dimensional stability (0.05 to 0.07 mils/inch), which often eliminates the need for double etching to achieve tight positional tolerances.
Cladding Options and Dielectric Thicknesses
Both electrodeposited and rolled copper foil cladding, ranging from ½ oz. to 2 oz./ft.², are available on dielectric thicknesses spanning 0.005" to 0.060" (0.127 to 1.524 mm).
Features and Benefits
Typical Applications
|
Property Dielectric Constant ε r |
Typical Value 2.94 ± 0.04 [3] |
Direction Z |
Units
- |
Conditions 10GHz/23°C |
Test Method IPC-TM-650, 2.5.5.5 |
| Dissipation Factor, TAN δ | 0.0015 | Z | - | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 |
| Thermal Coefficient of εr | +5 | Z | ppm/°C |
10 GHz -50 to +150°C |
IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 106 | Z | Mohm cm | A | ASTM D257 |
| Surface Resistivity | 109 | Z | Mohm | A | ASTM D257 |
| Tensile Modulus | 1007 (146) | X, Y | MPa (kpsi) |
23°C |
ASTM D638 |
| Ultimate Stress | 30 (4.3) | X, Y | MPs (kpsi) | ||
| Ultimate Strain | 4.9 | X, Y | % | ||
| Compressive Modulus | 1035 (150) | Z | MPa (kpsi) | ASTM D638 | |
| Moisture Absorption | 0.04 | - | % |
D23/24 D48/50 |
IPC-TM-650, 2.6.2.1 ASTM D570 |
| Thermal Conductivity | 0.68 | - | W/m/K | 80°C | ASTM C518 |
|
Coefficient of Thermal Expansion (-55 to 288 °C) |
15 15 30 |
X Y Z |
ppm/°C |
23°C/50% RH |
IPC-TM-650 2.4.41 |
| Dimensional Stability | 0.07 | X, Y | mm/m (mil/inch) | after etch +E/150 | IPC-TM-650, 2.4.3.9 |
| Td | 500 | °CTGA | ASTM D3850 | ||
| Density | 2.1 | gm/cm3 | ASTM D792 | ||
| Specific Heat | 0.93 (0.22) | - | J/g/K (BTU/lb/°F) | - | Calculated |
| Copper Peel | 9.1 (1.6) | lbs/in (N/mm) | IPC-TM-650 2.4.8 | ||
| Flammability | V-O | UL 94 | |||
| Lead-Free Process Com- patible | YES |
|
|
| 모크: | 1개 |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 가방 + 상자 |
| 배달 기간: | 8-9 영업일 |
| 지불 방법: | 티/티 |
| 공급 능력: | 달 당 5000PCS |
RT/duroid 6202 is a high-frequency circuit material formulated as a low-loss, low-dielectric-constant laminate. It delivers superior electrical and mechanical properties essential for designing complex microwave structures that require both mechanical reliability and electrical stability.
The inclusion of limited woven glass reinforcement provides excellent dimensional stability (0.05 to 0.07 mils/inch), which often eliminates the need for double etching to achieve tight positional tolerances.
Cladding Options and Dielectric Thicknesses
Both electrodeposited and rolled copper foil cladding, ranging from ½ oz. to 2 oz./ft.², are available on dielectric thicknesses spanning 0.005" to 0.060" (0.127 to 1.524 mm).
Features and Benefits
Typical Applications
|
Property Dielectric Constant ε r |
Typical Value 2.94 ± 0.04 [3] |
Direction Z |
Units
- |
Conditions 10GHz/23°C |
Test Method IPC-TM-650, 2.5.5.5 |
| Dissipation Factor, TAN δ | 0.0015 | Z | - | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 |
| Thermal Coefficient of εr | +5 | Z | ppm/°C |
10 GHz -50 to +150°C |
IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 106 | Z | Mohm cm | A | ASTM D257 |
| Surface Resistivity | 109 | Z | Mohm | A | ASTM D257 |
| Tensile Modulus | 1007 (146) | X, Y | MPa (kpsi) |
23°C |
ASTM D638 |
| Ultimate Stress | 30 (4.3) | X, Y | MPs (kpsi) | ||
| Ultimate Strain | 4.9 | X, Y | % | ||
| Compressive Modulus | 1035 (150) | Z | MPa (kpsi) | ASTM D638 | |
| Moisture Absorption | 0.04 | - | % |
D23/24 D48/50 |
IPC-TM-650, 2.6.2.1 ASTM D570 |
| Thermal Conductivity | 0.68 | - | W/m/K | 80°C | ASTM C518 |
|
Coefficient of Thermal Expansion (-55 to 288 °C) |
15 15 30 |
X Y Z |
ppm/°C |
23°C/50% RH |
IPC-TM-650 2.4.41 |
| Dimensional Stability | 0.07 | X, Y | mm/m (mil/inch) | after etch +E/150 | IPC-TM-650, 2.4.3.9 |
| Td | 500 | °CTGA | ASTM D3850 | ||
| Density | 2.1 | gm/cm3 | ASTM D792 | ||
| Specific Heat | 0.93 (0.22) | - | J/g/K (BTU/lb/°F) | - | Calculated |
| Copper Peel | 9.1 (1.6) | lbs/in (N/mm) | IPC-TM-650 2.4.8 | ||
| Flammability | V-O | UL 94 | |||
| Lead-Free Process Com- patible | YES |
