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| 모크: | 1개 |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 가방 + 상자 |
| 배달 기간: | 8-9 영업일 |
| 지불 방법: | 티/티 |
| 공급 능력: | 달 당 5000PCS |
F4BME294 is manufactured using glass fabric, PTFE resin, and PTFE film through a scientifically formulated composition and rigorous processing techniques. Its electrical performance represents an improvement over F4B, primarily characterized by a wider dielectric constant range, lower dielectric loss, increased insulation resistance, and enhanced stability, making it a suitable substitute for similar foreign products.
The F4BM and F4BME share the same dielectric layer but differ in the type of copper foil used: F4BM is paired with ED copper foil and is suitable for applications without PIM requirements; F4BME is paired with reverse-treated RTF copper foil, offering excellent PIM performance, more precise circuit control, and lower conductor loss.
F4BM and F4BME achieve precise dielectric constant adjustment by optimizing the ratio of PTFE to glass fabric. This approach not only delivers low loss but also enhances dimensional stability. A higher dielectric constant corresponds to a higher glass fabric content, resulting in improved dimensional stability, lower coefficient of thermal expansion, better temperature drift characteristics, and a slight increase in dielectric loss.
Product Features
Typical Applications
| Product Technical Parameters | Product Model & Data Sheet | |||
| Product Features | Test Conditions | Unit | F4BME294 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.94 | |
| Dielectric Constant Tolerance | / | / | ±0.06 | |
| Loss Tangent (Typical) | 10GHz | / | 0.0016 | |
| 20GHz | / | 0.0023 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -85 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >30 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >36 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 12, 15 |
| Z direction | -55 º~288ºC | ppm/ºC | 98 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.29 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.41 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | |
| Flammability | / | UL-94 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
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|
| 모크: | 1개 |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 가방 + 상자 |
| 배달 기간: | 8-9 영업일 |
| 지불 방법: | 티/티 |
| 공급 능력: | 달 당 5000PCS |
F4BME294 is manufactured using glass fabric, PTFE resin, and PTFE film through a scientifically formulated composition and rigorous processing techniques. Its electrical performance represents an improvement over F4B, primarily characterized by a wider dielectric constant range, lower dielectric loss, increased insulation resistance, and enhanced stability, making it a suitable substitute for similar foreign products.
The F4BM and F4BME share the same dielectric layer but differ in the type of copper foil used: F4BM is paired with ED copper foil and is suitable for applications without PIM requirements; F4BME is paired with reverse-treated RTF copper foil, offering excellent PIM performance, more precise circuit control, and lower conductor loss.
F4BM and F4BME achieve precise dielectric constant adjustment by optimizing the ratio of PTFE to glass fabric. This approach not only delivers low loss but also enhances dimensional stability. A higher dielectric constant corresponds to a higher glass fabric content, resulting in improved dimensional stability, lower coefficient of thermal expansion, better temperature drift characteristics, and a slight increase in dielectric loss.
Product Features
Typical Applications
| Product Technical Parameters | Product Model & Data Sheet | |||
| Product Features | Test Conditions | Unit | F4BME294 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.94 | |
| Dielectric Constant Tolerance | / | / | ±0.06 | |
| Loss Tangent (Typical) | 10GHz | / | 0.0016 | |
| 20GHz | / | 0.0023 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -85 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >30 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >36 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 12, 15 |
| Z direction | -55 º~288ºC | ppm/ºC | 98 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.29 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.41 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | |
| Flammability | / | UL-94 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
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