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| 모크: | 1개 |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 가방 + 상자 |
| 배달 기간: | 8-9 영업일 |
| 지불 방법: | 티/티 |
| 공급 능력: | 달 당 5000PCS |
The F4BTMS series is an upgraded product of the F4BTM series, incorporating technological breakthroughs in material formulation and manufacturing processes. A significant amount of ceramic is added to the material, which is reinforced with ultra-thin, ultra-fine glass fabric, resulting in greatly enhanced material performance and a wider dielectric constant range. This is an aerospace-grade, high-reliability material that can serve as a substitute for similar foreign products.
The use of a small amount of ultra-thin, ultra-fine glass fabric for reinforcement, combined with a uniform mixture of a large quantity of specialty nano-ceramics and PTFE resin, minimizes the glass fiber effect during electromagnetic wave propagation, reduces dielectric loss, and enhances dimensional stability. This lowers the anisotropy of the material in the X/Y/Z directions, increases the usable frequency, improves electrical strength, and enhances thermal conductivity. The material also exhibits excellent low coefficient of thermal expansion and stable dielectric temperature characteristics.
The F4BTMS series comes standard with RTF low-profile copper foil, which reduces conductor loss while providing excellent peel strength. It can be paired with copper or aluminum substrates. The F4BTMS294 can be combined with embedded 50Ω resistor copper foil to form a resistive film laminate.
The laminates can be processed using standard PTFE material processing techniques. The material's excellent mechanical and physical properties make it suitable for multilayer, high-multilayer, and backplane fabrication. It also demonstrates excellent processability in dense hole and fine line processing.
Product Features
- Tight tolerance on dielectric constant with excellent batch-to-batch consistency
- Ultra-low dielectric loss
- Stable dielectric constant and low loss values at frequencies up to 40 GHz, suitable for phase-sensitive applications
- Excellent dielectric constant and loss performance over temperature variations, maintaining stable frequency and phase characteristics from -55°C to 150°C
- Excellent radiation resistance, maintaining stable dielectric and physical properties after exposure to ionizing radiation
- Low outgassing performance, meeting aerospace vacuum outgassing requirements as tested by standard methods for material volatile properties under vacuum conditions
- Low coefficient of thermal expansion in X, Y, and Z directions, ensuring dimensional thermal stability and plated-through-hole reliability
- Improved thermal conductivity, suitable for higher power applications
- Excellent dimensional stability
- Low water absorption
Typical Applications
- Aerospace equipment, space, and cabin equipment
- Microwave and RF applications
- Radar, military radar
- Feed networks
- Phase-sensitive antennas, phased array antennas
- Satellite communications, and more
| Product Technical Parameters | Product Models & Data Sheet | ||
| Product Features | Test Conditions | Unit | F4BTMS294 |
| Dielectric Constant (Typical) | 10GHz | / | 2.94 |
| Dielectric Constant Tolerance | / | / | ±0.04 |
| Dielectric Constant (Design) | 10GHz | / | 2.94 |
| Loss Tangent (Typical) | 10GHz | / | 0.0012 |
| 20GHz | / | 0.0014 | |
| 40GHz | / | 0.0018 | |
| Dielectric Constant Temperature Coefficient | -55 º~150ºC | PPM/℃ | -20 |
| Peel Strength | 1 OZ RTF copper | N/mm | >1.2 |
| Volume Resistivity | Standard Condition | MΩ.cm | ≥1×10^8 |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^8 |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >40 |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >48 |
| Coefficientof Thermal Expansion (X, Y direction) | -55 º~288ºC | ppm/ºC | 10, 12 |
| Coefficientof Thermal Expansion (Z direction) | -55 º~288ºC | ppm/ºC | 22 |
| Thermal Stress | 260℃, 10s,3 times | / | No delamination |
| Water Absorption | 20±2℃, 24 hours | % | 0.02 |
| Density | Room Temperature | g/cm3 | 2.25 |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 |
| Thermal Conductivity | Z direction | W/(M.K) | 0.58 |
| Flammability | / | UL-94 | V-0 |
| Material Composition | / | / | PTFE,Ultra-thin and ultra-fine fiberglass, ceramics. |
|
|
| 모크: | 1개 |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 가방 + 상자 |
| 배달 기간: | 8-9 영업일 |
| 지불 방법: | 티/티 |
| 공급 능력: | 달 당 5000PCS |
The F4BTMS series is an upgraded product of the F4BTM series, incorporating technological breakthroughs in material formulation and manufacturing processes. A significant amount of ceramic is added to the material, which is reinforced with ultra-thin, ultra-fine glass fabric, resulting in greatly enhanced material performance and a wider dielectric constant range. This is an aerospace-grade, high-reliability material that can serve as a substitute for similar foreign products.
The use of a small amount of ultra-thin, ultra-fine glass fabric for reinforcement, combined with a uniform mixture of a large quantity of specialty nano-ceramics and PTFE resin, minimizes the glass fiber effect during electromagnetic wave propagation, reduces dielectric loss, and enhances dimensional stability. This lowers the anisotropy of the material in the X/Y/Z directions, increases the usable frequency, improves electrical strength, and enhances thermal conductivity. The material also exhibits excellent low coefficient of thermal expansion and stable dielectric temperature characteristics.
The F4BTMS series comes standard with RTF low-profile copper foil, which reduces conductor loss while providing excellent peel strength. It can be paired with copper or aluminum substrates. The F4BTMS294 can be combined with embedded 50Ω resistor copper foil to form a resistive film laminate.
The laminates can be processed using standard PTFE material processing techniques. The material's excellent mechanical and physical properties make it suitable for multilayer, high-multilayer, and backplane fabrication. It also demonstrates excellent processability in dense hole and fine line processing.
Product Features
- Tight tolerance on dielectric constant with excellent batch-to-batch consistency
- Ultra-low dielectric loss
- Stable dielectric constant and low loss values at frequencies up to 40 GHz, suitable for phase-sensitive applications
- Excellent dielectric constant and loss performance over temperature variations, maintaining stable frequency and phase characteristics from -55°C to 150°C
- Excellent radiation resistance, maintaining stable dielectric and physical properties after exposure to ionizing radiation
- Low outgassing performance, meeting aerospace vacuum outgassing requirements as tested by standard methods for material volatile properties under vacuum conditions
- Low coefficient of thermal expansion in X, Y, and Z directions, ensuring dimensional thermal stability and plated-through-hole reliability
- Improved thermal conductivity, suitable for higher power applications
- Excellent dimensional stability
- Low water absorption
Typical Applications
- Aerospace equipment, space, and cabin equipment
- Microwave and RF applications
- Radar, military radar
- Feed networks
- Phase-sensitive antennas, phased array antennas
- Satellite communications, and more
| Product Technical Parameters | Product Models & Data Sheet | ||
| Product Features | Test Conditions | Unit | F4BTMS294 |
| Dielectric Constant (Typical) | 10GHz | / | 2.94 |
| Dielectric Constant Tolerance | / | / | ±0.04 |
| Dielectric Constant (Design) | 10GHz | / | 2.94 |
| Loss Tangent (Typical) | 10GHz | / | 0.0012 |
| 20GHz | / | 0.0014 | |
| 40GHz | / | 0.0018 | |
| Dielectric Constant Temperature Coefficient | -55 º~150ºC | PPM/℃ | -20 |
| Peel Strength | 1 OZ RTF copper | N/mm | >1.2 |
| Volume Resistivity | Standard Condition | MΩ.cm | ≥1×10^8 |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^8 |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >40 |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >48 |
| Coefficientof Thermal Expansion (X, Y direction) | -55 º~288ºC | ppm/ºC | 10, 12 |
| Coefficientof Thermal Expansion (Z direction) | -55 º~288ºC | ppm/ºC | 22 |
| Thermal Stress | 260℃, 10s,3 times | / | No delamination |
| Water Absorption | 20±2℃, 24 hours | % | 0.02 |
| Density | Room Temperature | g/cm3 | 2.25 |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 |
| Thermal Conductivity | Z direction | W/(M.K) | 0.58 |
| Flammability | / | UL-94 | V-0 |
| Material Composition | / | / | PTFE,Ultra-thin and ultra-fine fiberglass, ceramics. |
