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Rogers TMM10i PCB 30mil Substrate 1OZ Copper

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중국 Bicheng Electronics Technology Co., Ltd 인증
중국 Bicheng Electronics Technology Co., Ltd 인증
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Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— 부유한 리켓

루스, 나는 오늘 PCB를 얻었고 그들이 단지 완벽합니다. 약간의 인내를 멈추게 하시오 그러면 내 다음 명령은 곧 다가오고 있습니다. 종류는 함부르크로부터 주목합니다 올라프

—— 올라프 쿤홀드

하와이 나탈리. 그것은 완벽했습니다, 내가 참고를 위해 약간의 사진을 첨부합니다. 그리고 나는 예산에 당신에게 다음 2 사업을 보냅니다. 다시 대단히 감사합니다

—— 세바스챤 탑리제크

케빈, 감사, 그들이 완전히 만들어졌고, 잘 작동합니다. 약속된 대로 당신이 나를 위해 제조한 PCB를 사용하는 내 최근의 프로젝트를 위한 링크가 여기 있습니다 : 관계, 다니엘

—— 다니엘 포드

제가 지금 온라인 채팅 해요

Rogers TMM10i PCB 30mil Substrate 1OZ Copper

Rogers TMM10i PCB 30mil Substrate 1OZ Copper
Rogers TMM10i PCB 30mil Substrate 1OZ Copper

큰 이미지 :  Rogers TMM10i PCB 30mil Substrate 1OZ Copper

제품 상세 정보:
원래 장소: 중국
브랜드 이름: Bicheng
인증: UL, ISO9001, IATF16949
모델 번호: BIC-052.V1.0
결제 및 배송 조건:
최소 주문 수량: 1pcs
가격: USD9.99-99.99
포장 세부 사항: 진공 백+상자
배달 시간: 8-9 근무일
지불 조건: t/t
공급 능력: 한 달에 5000pc

Rogers TMM10i PCB 30mil Substrate 1OZ Copper

설명
기본 자료: 로저스 TMM10i 레이어 수: 2 층
PCB 두께: 0.8mm PCB 크기: 70mm x 75mm
구리 중량: 1oz (1.4 mils 또는 35μm에 해당) 표면 마감: 침지 주석
강조하다:

Rogers TMM10i PCB board

,

30mil substrate PCB

,

1OZ copper Rogers PCB

Rogers TMM10i PCB 30mil Substrate 1OZ Copper

This double-sided (2-layer) rigid PCB is built with Rogers TMM10i, an isotropic thermoset microwave composite optimized for high-reliability RF and microwave applications.

 

1. PCB Specifications

Parameter Specification
Base Material Rogers TMM10i (ceramic thermoset polymer composite)
Layer Configuration Double-sided (2-layer, no blind vias—simplifies fabrication and reduces defects)
Board Dimensions 70mm x 75mm per unit (tolerance: ±0.15mm for consistent assembly fit)
Minimum Trace/Space 6/4 mils (enables dense routing for compact RF/microwave designs)
Minimum Hole Size 0.3mm (supports miniaturized thru-hole components and precise via placement)
Finished Board Thickness 0.8mm (thin-profile for space-constrained applications like antennas)
Finished Copper Weight 1oz (1.4 mils, 35μm per outer layer—balances conductivity and design flexibility)
Via Plating Thickness 20μm (enhances thru-hole reliability and current-carrying capacity)
Surface Finish Immersion tin (delivers corrosion resistance, low contact resistance, and excellent solderability)
Silkscreen (Top/Bottom) No / No (optimized for unobstructed signal paths in high-frequency circuits)
Solder Mask (Top/Bottom) No / No (avoids dielectric interference in microwave applications)
Quality Assurance 100% electrical testing prior to shipment (eliminates open circuits/shorts)

 

2. PCB Stac-kup

Layer/Component Specification
Copper Layer 1 35μm (1oz)
Rogers TMM10i Core 0.762mm (30mil)
Copper Layer 2 35μm (1oz)

 

Rogers TMM10i PCB 30mil Substrate 1OZ Copper 0

 

3. Quality Standards

Artwork Format: Gerber RS-274-X

 

Quality Certification: IPC-Class-2

 

Global Availability: Supplied worldwide to support international projects

 

4. Rogers TMM10i Material: Key Attributes

TMM10i is a ceramic thermoset composite that merges ceramic’s dielectric stability with PTFE’s processability, ideal for microwave and RF circuits:

 

Core Features

Feature Specification
Dielectric Constant (Dk) 9.80 ± 0.245 (isotropic—consistent across all axes for predictable signal behavior)
Dissipation Factor (Df) 0.0020 at 10GHz (ultra-low for minimal signal loss in high-frequency circuits)
Thermal Coefficient of Dk -43 ppm/°K (stable dielectric properties across temperature fluctuations)
CTE (x/y/z) 19ppm/K, 19ppm/K, 20ppm/K (matched to copper—reduces thermal stress and delamination)
Decomposition Temperature (Td) 425°C (high thermal stability for harsh environments)
Thermal Conductivity 0.76 W/mK (efficient heat transfer for power amplifiers and high-power circuits)
Thickness Range 0.0015–0.500 inches (±0.0015”)—flexible for custom design needs

 

5. Key Benefits

-Mechanical Durability: Resists creep and cold flow, ensuring long-term structural stability.

 

-Chemical Resistance: Withstands process chemicals, reducing damage during fabrication.

 

-Simplified Plating: No sodium napthanate treatment required prior to electroless plating—lowers production costs.

 

-Reliable Wire-Bonding: Thermoset resin base enables secure wire-bond connections for high-frequency components.

 

6. Typical Applications

This PCB is optimized for applications demanding stable dielectric performance and high reliability:

 

-RF and microwave circuitry (e.g., signal amplifiers, oscillators)

-Power amplifiers and combiners (high thermal conductivity supports heat management)

-Filters and couplers (isotropic Dk ensures precise signal filtering)

-Satellite communication systems (resists harsh environmental conditions)

-Global Positioning Systems (GPS) Antennas (stable Dk for accurate signal reception)

-Patch Antennas (thin profile and low Df enhance antenna efficiency)

-Dielectric polarizers and lenses (consistent Dk for lightwave control)

-Chip testers (reliable thru-holes support repeated component testing)

 

Conclusion

This double-sided TMM10i PCB delivers the precision, stability, and durability required for high-frequency RF and microwave applications. It is a trusted solution for engineers seeking to optimize performance in circuits like antennas, power amplifiers, and satellite communications systems.

 

Rogers TMM10i PCB 30mil Substrate 1OZ Copper 1

연락처 세부 사항
Bicheng Electronics Technology Co., Ltd

담당자: Ms. Ivy Deng

전화 번호: 86-755-27374946

팩스: 86-755-27374848

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