|
| 모크: | 1개 |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 백+상자 |
| 배달 기간: | 8-9 근무일 |
| 지불 방법: | 티/티 |
| 공급 능력: | 한 달에 5000pc |
This high-performance PCB is constructed with Rogers RT/duroid 5880--a premium PTFE composite reinforced with glass microfibers--and engineered for demanding high-frequency applications.
| Parameter | Details |
|---|---|
| Base Material | Rogers RT/duroid 5880 (PTFE composite reinforced with glass microfibers) |
| Layer Count | 2-layer rigid PCB |
| Board Dimensions | 90mm x 90mm (1 piece)±0.15mm |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.3mm |
| Via Type | No blind vias (thru-hole vias only) |
| Finished Board Thickness | 1.6mm |
| Copper Weight (Finished) | 1oz (equivalent to 1.4 mils / 35 μm per layer) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold (for enhanced conductivity and corrosion resistance) |
| Silkscreen | Top: No; Bottom: No |
| Solder Mask | Top: No; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
The board's stack-up is optimized for consistent electrical performance and mechanical stability:
| Layer Type | Material/Description | Thickness |
|---|---|---|
| Copper Layer 1 | Conductive copper (finished) | 35 μm (1oz) |
| Dielectric Layer | Rogers RT/duroid 5880 | 5.575 mm (62 mils) |
| Copper Layer 2 | Conductive copper (finished) | 35 μm (1oz) |
Rogers RT/duroid 5880 is a premium high-frequency laminate designed for stripline and microstrip circuits. Its randomly oriented glass microfibers deliver exceptional dielectric constant uniformity, while its PTFE base ensures low electrical loss--making it ideal for applications requiring reliability across wide frequency ranges. The material is resistant to all solvents and reagents (hot or cold) used in PCB etching, plating, and processing, and it supports lead-free manufacturing processes.
| Specification | Value |
|---|---|
| Dielectric Constant (εr) | 2.2 ± 0.02 at 10 GHz / 23°C (uniform panel-to-panel) |
| Dissipation Factor (tanδ) | 0.0009 at 10 GHz |
| Temperature Coefficient of Dielectric Constant (TCDk) | -125 ppm/°C |
| Moisture Absorption | 0.02% |
| Coefficient of Thermal Expansion (CTE) - X-axis | 31 ppm/°C |
| Coefficient of Thermal Expansion (CTE) - Y-axis | 48 ppm/°C |
| Coefficient of Thermal Expansion (CTE) - Z-axis | 237 ppm/°C |
| Thermal Stability (Td, 5% weight loss via TGA) | 500 °C |
| Flammability Rating | UL 94-V0 |
| Lead-Free Compatibility | Yes (RoHS-compliant process compatible) |
| Isotropy | Yes (uniform properties across all axes) |
This PCB is engineered for high-performance systems requiring precision and reliability, including:
|
|
| 모크: | 1개 |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 백+상자 |
| 배달 기간: | 8-9 근무일 |
| 지불 방법: | 티/티 |
| 공급 능력: | 한 달에 5000pc |
This high-performance PCB is constructed with Rogers RT/duroid 5880--a premium PTFE composite reinforced with glass microfibers--and engineered for demanding high-frequency applications.
| Parameter | Details |
|---|---|
| Base Material | Rogers RT/duroid 5880 (PTFE composite reinforced with glass microfibers) |
| Layer Count | 2-layer rigid PCB |
| Board Dimensions | 90mm x 90mm (1 piece)±0.15mm |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.3mm |
| Via Type | No blind vias (thru-hole vias only) |
| Finished Board Thickness | 1.6mm |
| Copper Weight (Finished) | 1oz (equivalent to 1.4 mils / 35 μm per layer) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold (for enhanced conductivity and corrosion resistance) |
| Silkscreen | Top: No; Bottom: No |
| Solder Mask | Top: No; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
The board's stack-up is optimized for consistent electrical performance and mechanical stability:
| Layer Type | Material/Description | Thickness |
|---|---|---|
| Copper Layer 1 | Conductive copper (finished) | 35 μm (1oz) |
| Dielectric Layer | Rogers RT/duroid 5880 | 5.575 mm (62 mils) |
| Copper Layer 2 | Conductive copper (finished) | 35 μm (1oz) |
Rogers RT/duroid 5880 is a premium high-frequency laminate designed for stripline and microstrip circuits. Its randomly oriented glass microfibers deliver exceptional dielectric constant uniformity, while its PTFE base ensures low electrical loss--making it ideal for applications requiring reliability across wide frequency ranges. The material is resistant to all solvents and reagents (hot or cold) used in PCB etching, plating, and processing, and it supports lead-free manufacturing processes.
| Specification | Value |
|---|---|
| Dielectric Constant (εr) | 2.2 ± 0.02 at 10 GHz / 23°C (uniform panel-to-panel) |
| Dissipation Factor (tanδ) | 0.0009 at 10 GHz |
| Temperature Coefficient of Dielectric Constant (TCDk) | -125 ppm/°C |
| Moisture Absorption | 0.02% |
| Coefficient of Thermal Expansion (CTE) - X-axis | 31 ppm/°C |
| Coefficient of Thermal Expansion (CTE) - Y-axis | 48 ppm/°C |
| Coefficient of Thermal Expansion (CTE) - Z-axis | 237 ppm/°C |
| Thermal Stability (Td, 5% weight loss via TGA) | 500 °C |
| Flammability Rating | UL 94-V0 |
| Lead-Free Compatibility | Yes (RoHS-compliant process compatible) |
| Isotropy | Yes (uniform properties across all axes) |
This PCB is engineered for high-performance systems requiring precision and reliability, including:
