| 모크: | 1개 |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 백+상자 |
| 배달 기간: | 8-9 근무일 |
| 지불 방법: | 티/티 |
| 공급 능력: | 한 달에 5000pc |
| Parameter | Details |
|---|---|
| Base Material | Rogers RT/duroid 6006 (ceramic-PTFE composite) |
| Layer Count | 2-Layer rigid PCB |
| Board Dimensions | 43mm x 107.5mm (1 piece)±0.15mm |
| Minimum Trace/Space | 4/4 mils |
| Minimum Hole Size | 0.2mm |
| Via Type | No blind vias (thru-hole vias only) |
| Finished Board Thickness | 0.35mm |
| Finished Copper Weight (Outer Layers) | 1oz (equivalent to 1.4 mils / 35 μm per layer) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold (enhanced conductivity, corrosion resistance) |
| Silkscreen | Top: Black; Bottom: No |
| Solder Mask | Top: No; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
| Layer Type | Material/Description | Thickness |
|---|---|---|
| Copper Layer 1 (Outer) | Conductive electrodeposited copper (finished) | 35 μm (1oz) |
| Dielectric Layer | Rogers RT/duroid 6006 | 0.254 mm (10 mils) |
| Copper Layer 2 (Outer) | Conductive electrodeposited copper (finished) | 35 μm (1oz) |
| Specification | Value |
|---|---|
| Material Type | Ceramic-PTFE composite |
| Dielectric Constant (Dk) | 6.15 ± 0.15 at 10 GHz / 23°C |
| Dissipation Factor (tanδ) | 0.0027 at 10 GHz / 23°C |
| Thermal Stability (Td, TGA) | >500 °C |
| Moisture Absorption | 0.05% |
| Coefficient of Thermal Expansion (CTE) - X-axis | 47 ppm/°C |
| Coefficient of Thermal Expansion (CTE) - Y-axis | 34 ppm/°C |
| Coefficient of Thermal Expansion (CTE) - Z-axis | 117 ppm/°C |
| Copper Foil Type | Standard/reverse treated electrodeposited |
| Flammability Rating | UL 94-V0 |
| Lead-Free Compatibility | Yes |
| 모크: | 1개 |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 백+상자 |
| 배달 기간: | 8-9 근무일 |
| 지불 방법: | 티/티 |
| 공급 능력: | 한 달에 5000pc |
| Parameter | Details |
|---|---|
| Base Material | Rogers RT/duroid 6006 (ceramic-PTFE composite) |
| Layer Count | 2-Layer rigid PCB |
| Board Dimensions | 43mm x 107.5mm (1 piece)±0.15mm |
| Minimum Trace/Space | 4/4 mils |
| Minimum Hole Size | 0.2mm |
| Via Type | No blind vias (thru-hole vias only) |
| Finished Board Thickness | 0.35mm |
| Finished Copper Weight (Outer Layers) | 1oz (equivalent to 1.4 mils / 35 μm per layer) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold (enhanced conductivity, corrosion resistance) |
| Silkscreen | Top: Black; Bottom: No |
| Solder Mask | Top: No; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
| Layer Type | Material/Description | Thickness |
|---|---|---|
| Copper Layer 1 (Outer) | Conductive electrodeposited copper (finished) | 35 μm (1oz) |
| Dielectric Layer | Rogers RT/duroid 6006 | 0.254 mm (10 mils) |
| Copper Layer 2 (Outer) | Conductive electrodeposited copper (finished) | 35 μm (1oz) |
| Specification | Value |
|---|---|
| Material Type | Ceramic-PTFE composite |
| Dielectric Constant (Dk) | 6.15 ± 0.15 at 10 GHz / 23°C |
| Dissipation Factor (tanδ) | 0.0027 at 10 GHz / 23°C |
| Thermal Stability (Td, TGA) | >500 °C |
| Moisture Absorption | 0.05% |
| Coefficient of Thermal Expansion (CTE) - X-axis | 47 ppm/°C |
| Coefficient of Thermal Expansion (CTE) - Y-axis | 34 ppm/°C |
| Coefficient of Thermal Expansion (CTE) - Z-axis | 117 ppm/°C |
| Copper Foil Type | Standard/reverse treated electrodeposited |
| Flammability Rating | UL 94-V0 |
| Lead-Free Compatibility | Yes |