|
| 모크: | 1개 |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 백+상자 |
| 배달 기간: | 8-9 근무일 |
| 지불 방법: | 티/티 |
| 공급 능력: | 달 당 5000pcs |
RT/duroid® 5880LZ laminates are engineered filled PTFE composites, purpose-built for precision stripline and microstrip circuit applications.
A unique filler system yields a low-density, lightweight material ideal for high-performance designs where weight is a critical factor.
These laminates offer a very low and stable dielectric constant, which is highly uniform across panels and remains consistent over a broad frequency range. Coupled with an exceptionally low dissipation factor, this electrical stability makes RT/duroid 5880LZ suitable for applications extending into Ku-band and beyond.
From a fabrication standpoint, RT/duroid 5880LZ laminates are easily cut, sheared, and machined. They exhibit strong chemical resistance, remaining unaffected by the solvents and reagents commonly used in printed circuit etching, plating, and hole preparation processes.
To ensure optimal performance, please specify the following when ordering:
-Dielectric thickness and tolerance
-Electrodeposited copper foil type
-Copper foil weight
| Property | Typical Value | Direction | Units | Condition | Test Method |
| Dielectric Constant Process | 2.00 ± 0.04 | Z | - | 10 GHz/23°C | IPC-TM-650, [2.5.5.5](2.5.5.5) |
| Dielectric Constant Design | 2.00 | Z | - | 8 GHz - 40 GHz | Differential Phase Length Method |
| Dissipation Factor <br>Typ<br>Max | 0.0021<br>0.0027 | Z | - | 10 GHz/23°C | IPC-TM-650, [2.5.5.5](2.5.5.5) |
| Thermal Coefficient of Dielectric Constant | +20 | Z | ppm/°C | -50°C to 150°C, 10 GHz | IPC-TM-650, [2.5.5.5](2.5.5.5) |
| Volume Resistivity | 1.74X107 | - | Mohm•cm | C-96/35/90 | IPC-TM-650, [2.5.17.1](2.5.17.1) |
| Surface Resistivity | 2.08X106 | - | Mohm | C-96/35/90 | IPC-TM-650, [2.5.17.1](2.5.17.1) |
| Electrical Strength | 40 | - | kV | D48/50 | IPC-TM-650, 2.5.6 |
| Dimensional Stability | -0.38 | X,Y | % | - | IPC-TM-650, 2.4.39A |
| Moisture Absorption | 0.31 | - | % | 24 hours/23°C | IPC-TM-650, [2.6.2.1](2.6.2.1) |
| Thermal Conductivity | 0.33 | Z | W/m/°K | 80°C | ASTM C518 |
| Coefficient of Thermal Expansion | 54, 47<br>40 | X,Y<br>Z | ppm/°C | 0 to 150°C | IPC-TM-650, 2.4.41 |
| Outgassing<br>TML<br>CVCM<br>WVR | 0.01<br>0.01<br>0.01 | - | % | - | ASTM E-595 |
| Density | 1.4 | - | gm/cm³ | - | ASTM D792 |
| Copper Peel Strength | >4.0 | - | pli | - | IPC-TM-650, 2.4.8 |
| Flammability | V-0 | - | - | - | UL 94 |
| Lead-Free Process Compatibility | YES | - | - | - | - |
Features:
• Lowest dielectric constant available
• Low Z-axis CTE
• Lightweight / low density
• Uniform electrical properties over a wide frequency range
Some Typical Applications:
• Airborne antenna system
• Lightweight feed networks
• Military radar systems
• Missile guidance systems
• Point-to-point digital radio antennas
|
|
| 모크: | 1개 |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 백+상자 |
| 배달 기간: | 8-9 근무일 |
| 지불 방법: | 티/티 |
| 공급 능력: | 달 당 5000pcs |
RT/duroid® 5880LZ laminates are engineered filled PTFE composites, purpose-built for precision stripline and microstrip circuit applications.
A unique filler system yields a low-density, lightweight material ideal for high-performance designs where weight is a critical factor.
These laminates offer a very low and stable dielectric constant, which is highly uniform across panels and remains consistent over a broad frequency range. Coupled with an exceptionally low dissipation factor, this electrical stability makes RT/duroid 5880LZ suitable for applications extending into Ku-band and beyond.
From a fabrication standpoint, RT/duroid 5880LZ laminates are easily cut, sheared, and machined. They exhibit strong chemical resistance, remaining unaffected by the solvents and reagents commonly used in printed circuit etching, plating, and hole preparation processes.
To ensure optimal performance, please specify the following when ordering:
-Dielectric thickness and tolerance
-Electrodeposited copper foil type
-Copper foil weight
| Property | Typical Value | Direction | Units | Condition | Test Method |
| Dielectric Constant Process | 2.00 ± 0.04 | Z | - | 10 GHz/23°C | IPC-TM-650, [2.5.5.5](2.5.5.5) |
| Dielectric Constant Design | 2.00 | Z | - | 8 GHz - 40 GHz | Differential Phase Length Method |
| Dissipation Factor <br>Typ<br>Max | 0.0021<br>0.0027 | Z | - | 10 GHz/23°C | IPC-TM-650, [2.5.5.5](2.5.5.5) |
| Thermal Coefficient of Dielectric Constant | +20 | Z | ppm/°C | -50°C to 150°C, 10 GHz | IPC-TM-650, [2.5.5.5](2.5.5.5) |
| Volume Resistivity | 1.74X107 | - | Mohm•cm | C-96/35/90 | IPC-TM-650, [2.5.17.1](2.5.17.1) |
| Surface Resistivity | 2.08X106 | - | Mohm | C-96/35/90 | IPC-TM-650, [2.5.17.1](2.5.17.1) |
| Electrical Strength | 40 | - | kV | D48/50 | IPC-TM-650, 2.5.6 |
| Dimensional Stability | -0.38 | X,Y | % | - | IPC-TM-650, 2.4.39A |
| Moisture Absorption | 0.31 | - | % | 24 hours/23°C | IPC-TM-650, [2.6.2.1](2.6.2.1) |
| Thermal Conductivity | 0.33 | Z | W/m/°K | 80°C | ASTM C518 |
| Coefficient of Thermal Expansion | 54, 47<br>40 | X,Y<br>Z | ppm/°C | 0 to 150°C | IPC-TM-650, 2.4.41 |
| Outgassing<br>TML<br>CVCM<br>WVR | 0.01<br>0.01<br>0.01 | - | % | - | ASTM E-595 |
| Density | 1.4 | - | gm/cm³ | - | ASTM D792 |
| Copper Peel Strength | >4.0 | - | pli | - | IPC-TM-650, 2.4.8 |
| Flammability | V-0 | - | - | - | UL 94 |
| Lead-Free Process Compatibility | YES | - | - | - | - |
Features:
• Lowest dielectric constant available
• Low Z-axis CTE
• Lightweight / low density
• Uniform electrical properties over a wide frequency range
Some Typical Applications:
• Airborne antenna system
• Lightweight feed networks
• Military radar systems
• Missile guidance systems
• Point-to-point digital radio antennas
