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PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

모크: 1개
가격: USD9.99-99.99
표준 포장: 진공 가방 + 상자
배달 기간: 8-9 영업일
지불 방법: 티/티
공급 능력: 달 당 5000PCS
자세한 정보
원래 장소
중국
브랜드 이름
Bicheng
인증
UL, ISO9001, IATF16949
모델 번호
BIC-332.V1.0
부품 번호:
TLY-3
라미네이트 두께:
0.0035인치; 0.0050인치; 0.0075인치; 0.0100인치
라미네이트 크기:
12 x 18인치(305 x 457mm); 16 x 36인치(406 x 914mm); 16 x 18인치(406 x 457mm); 24 x 36인치(610 x 914mm); 18 x
구리 무게:
1/2온스 ED 구리; 1 온스. CL1 구리, 1온스 C1 캅페
강조하다:

PCB material TLY-3 laminate

,

high frequency copper clad sheet

,

TLY-3 copper clad laminate

제품 설명

TLY-3 laminates are fabricated using ultra-lightweight woven fiberglass, offering significantly greater dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiberglass matrix delivers a mechanically robust laminate ideal for high-volume production. Featuring an extremely low dissipation factor, TLY-3 performs reliably in 77 GHz automotive radar systems and other millimeter-wave antenna designs.

 

Comparative OEM testing at 77 GHz between low-reinforcement TLY-3 and its nearest chopped fiber-reinforced competitor demonstrated comparable “drop-in” insertion loss and dielectric performance, with the key advantage of drastically improved manufacturing yields. The dielectric constant (Dk) ranges from 2.17 to 2.40. For most thicknesses, Dk can be specified at any value within this range with a tight tolerance of ±0.02. At 10 GHz, the typical dissipation factor (Df) in the low-Dk region is approximately 0.0009.

 

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

 

PCB Material TLY-3  High Frequency Laminates Copper Clad Sheet 0

 

Properties Conditions Typical Value Unit Test Method

Electrical Properties

 

Dielectric Constant @ 10 GHz 2.33 ± 0.02 - IPC-650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0012 - IPC-650 2.5.5.5
Volume Resistivity (after elevated temp.) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Volume Resistivity (after humidity) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Surface Resistivity (after elevated temp.) 10⁸ Mohms IPC-650 2.5.17.1
Surface Resistivity (after humidity) 10⁸ Mohms IPC-650 2.5.17.1
Thermal Properties Thermal Conductivity 0.22 W/M*K ASTM F 433
CTE (25-260°C) - X 26 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Y 15 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Z 217 ppm/°C ASTM D 3386 (TMA)
Mechanical Properties Peel Strength - 1/2 oz. ED copper 1.96 (11) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. CL1 copper 2.86 (16) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. C1 copper 3.04 (17) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength (at elevated temp.) 2.32 (13) N/mm (Ibs/in) IPC-650 2.4.8
Flexural Strength - MD 96.91 (14,057) N/mm² (psi) IPC-650 2.4.4
Flexural Strength - CD 89.32 (12,955) N/mm² (psi) IPC-650 2.4.4
Young’s Modulus - MD 9.65 X 10³ (1.4 X 10⁶) N/mm² (psi) ASTM D 3039 / IPC-650 2.4.19
Poisson’s Ratio - MD 0.21 - ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties Density Specific Gravity 2.19 g/cm³ ASTM D 792
Mechanical Properties Dimensional Stability - MD, 10 mil -0.038 mm/M (mils/in) IPC-650 2.4.39
Mechanical Properties Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress) -0.038 mm/M (mils/in) -
Chemical / Physical Properties Moisture Absorption 0.02 % IPC-650 2.6.2.1
NASA Outgassing - TML 0.01 % -
NASA Outgassing - CVCM 0.01 % -
NASA Outgassing - WVR 0.01 % -
UL-94 Flammability Rating V-0 - UL-94

 

Key Benefits

  • Excellent dimensional stability
  • Ultra-low dissipation factor (Df)
  • High peel strength
  • Low moisture absorption
  • Consistent, uniform dielectric constant (Dk)
  • Laser-ablatable

 

Target Applications

  • Automotive radar
  • Satellite and cellular communications
  • Power amplifiers
  • LNBs, LNAs, and LNCs
  • Aerospace systems
  • Ka-band, E-band, and W-band applications
상품
제품 세부 정보
PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet
모크: 1개
가격: USD9.99-99.99
표준 포장: 진공 가방 + 상자
배달 기간: 8-9 영업일
지불 방법: 티/티
공급 능력: 달 당 5000PCS
자세한 정보
원래 장소
중국
브랜드 이름
Bicheng
인증
UL, ISO9001, IATF16949
모델 번호
BIC-332.V1.0
부품 번호:
TLY-3
라미네이트 두께:
0.0035인치; 0.0050인치; 0.0075인치; 0.0100인치
라미네이트 크기:
12 x 18인치(305 x 457mm); 16 x 36인치(406 x 914mm); 16 x 18인치(406 x 457mm); 24 x 36인치(610 x 914mm); 18 x
구리 무게:
1/2온스 ED 구리; 1 온스. CL1 구리, 1온스 C1 캅페
최소 주문 수량:
1개
가격:
USD9.99-99.99
포장 세부 사항:
진공 가방 + 상자
배달 시간:
8-9 영업일
지불 조건:
티/티
공급 능력:
달 당 5000PCS
강조하다

PCB material TLY-3 laminate

,

high frequency copper clad sheet

,

TLY-3 copper clad laminate

제품 설명

TLY-3 laminates are fabricated using ultra-lightweight woven fiberglass, offering significantly greater dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiberglass matrix delivers a mechanically robust laminate ideal for high-volume production. Featuring an extremely low dissipation factor, TLY-3 performs reliably in 77 GHz automotive radar systems and other millimeter-wave antenna designs.

 

Comparative OEM testing at 77 GHz between low-reinforcement TLY-3 and its nearest chopped fiber-reinforced competitor demonstrated comparable “drop-in” insertion loss and dielectric performance, with the key advantage of drastically improved manufacturing yields. The dielectric constant (Dk) ranges from 2.17 to 2.40. For most thicknesses, Dk can be specified at any value within this range with a tight tolerance of ±0.02. At 10 GHz, the typical dissipation factor (Df) in the low-Dk region is approximately 0.0009.

 

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

 

PCB Material TLY-3  High Frequency Laminates Copper Clad Sheet 0

 

Properties Conditions Typical Value Unit Test Method

Electrical Properties

 

Dielectric Constant @ 10 GHz 2.33 ± 0.02 - IPC-650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0012 - IPC-650 2.5.5.5
Volume Resistivity (after elevated temp.) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Volume Resistivity (after humidity) 10¹⁰ Mohms/cm IPC-650 2.5.17.1
Surface Resistivity (after elevated temp.) 10⁸ Mohms IPC-650 2.5.17.1
Surface Resistivity (after humidity) 10⁸ Mohms IPC-650 2.5.17.1
Thermal Properties Thermal Conductivity 0.22 W/M*K ASTM F 433
CTE (25-260°C) - X 26 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Y 15 ppm/°C ASTM D 3386 (TMA)
CTE (25-260°C) - Z 217 ppm/°C ASTM D 3386 (TMA)
Mechanical Properties Peel Strength - 1/2 oz. ED copper 1.96 (11) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. CL1 copper 2.86 (16) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength - 1 oz. C1 copper 3.04 (17) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength (at elevated temp.) 2.32 (13) N/mm (Ibs/in) IPC-650 2.4.8
Flexural Strength - MD 96.91 (14,057) N/mm² (psi) IPC-650 2.4.4
Flexural Strength - CD 89.32 (12,955) N/mm² (psi) IPC-650 2.4.4
Young’s Modulus - MD 9.65 X 10³ (1.4 X 10⁶) N/mm² (psi) ASTM D 3039 / IPC-650 2.4.19
Poisson’s Ratio - MD 0.21 - ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties Density Specific Gravity 2.19 g/cm³ ASTM D 792
Mechanical Properties Dimensional Stability - MD, 10 mil -0.038 mm/M (mils/in) IPC-650 2.4.39
Mechanical Properties Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress) -0.038 mm/M (mils/in) -
Chemical / Physical Properties Moisture Absorption 0.02 % IPC-650 2.6.2.1
NASA Outgassing - TML 0.01 % -
NASA Outgassing - CVCM 0.01 % -
NASA Outgassing - WVR 0.01 % -
UL-94 Flammability Rating V-0 - UL-94

 

Key Benefits

  • Excellent dimensional stability
  • Ultra-low dissipation factor (Df)
  • High peel strength
  • Low moisture absorption
  • Consistent, uniform dielectric constant (Dk)
  • Laser-ablatable

 

Target Applications

  • Automotive radar
  • Satellite and cellular communications
  • Power amplifiers
  • LNBs, LNAs, and LNCs
  • Aerospace systems
  • Ka-band, E-band, and W-band applications
사이트맵 |  개인정보 보호 정책 | 중국 좋은 품질 타코닉 PCB 공급자. 저작권 2020-2026 Bicheng Electronics Technology Co., Ltd 모두 모든 권리 보호