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| 모크: | 1개 |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 가방 + 상자 |
| 배달 기간: | 8-9 영업일 |
| 지불 방법: | 티/티 |
| 공급 능력: | 달 당 5000PCS |
F4BME245 is manufactured through a scientifically formulated process and strict pressing techniques, utilizing fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. Its electrical performance is enhanced compared to F4B, primarily reflected in a wider dielectric constant range, lower dielectric loss, increased insulation resistance, and improved stability, making it a viable alternative to similar international products.
F4BM and F4BME share the same dielectric layer but differ in the copper foil used: F4BM is paired with ED copper foil, suitable for applications without PIM requirements; F4BME is paired with reverse-treated RTF copper foil, offering excellent PIM performance, more precise circuit control, and lower conductor loss.
F4BM and F4BME achieve precise dielectric constant control by adjusting the ratio between PTFE and fiberglass cloth, ensuring low loss while enhancing material dimensional stability. A higher dielectric constant corresponds to a higher fiberglass ratio, resulting in better dimensional stability, lower coefficient of thermal expansion (CTE), improved thermal drift performance, and relatively increased dielectric loss.
Product Features
Typical Applications
| Product Technical Parameters | Product Model & Data Sheet | |||
| Product Features | Test Conditions | Unit | F4BME245 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.45 | |
| Dielectric Constant Tolerance | / | / | ±0.05 | |
| Loss Tangent (Typical) | 10GHz | / | 0.0012 | |
| 20GHz | / | 0.0017 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -120 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >25 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >32 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 20, 25 |
| Z direction | -55 º~288ºC | ppm/ºC | 187 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.22 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.30 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | |
| Flammability | / | UL-94 | V-0 | |
| Material Composition | / | / |
PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
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|
| 모크: | 1개 |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 가방 + 상자 |
| 배달 기간: | 8-9 영업일 |
| 지불 방법: | 티/티 |
| 공급 능력: | 달 당 5000PCS |
F4BME245 is manufactured through a scientifically formulated process and strict pressing techniques, utilizing fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. Its electrical performance is enhanced compared to F4B, primarily reflected in a wider dielectric constant range, lower dielectric loss, increased insulation resistance, and improved stability, making it a viable alternative to similar international products.
F4BM and F4BME share the same dielectric layer but differ in the copper foil used: F4BM is paired with ED copper foil, suitable for applications without PIM requirements; F4BME is paired with reverse-treated RTF copper foil, offering excellent PIM performance, more precise circuit control, and lower conductor loss.
F4BM and F4BME achieve precise dielectric constant control by adjusting the ratio between PTFE and fiberglass cloth, ensuring low loss while enhancing material dimensional stability. A higher dielectric constant corresponds to a higher fiberglass ratio, resulting in better dimensional stability, lower coefficient of thermal expansion (CTE), improved thermal drift performance, and relatively increased dielectric loss.
Product Features
Typical Applications
| Product Technical Parameters | Product Model & Data Sheet | |||
| Product Features | Test Conditions | Unit | F4BME245 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.45 | |
| Dielectric Constant Tolerance | / | / | ±0.05 | |
| Loss Tangent (Typical) | 10GHz | / | 0.0012 | |
| 20GHz | / | 0.0017 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -120 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >25 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >32 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 20, 25 |
| Z direction | -55 º~288ºC | ppm/ºC | 187 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.22 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.30 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | |
| Flammability | / | UL-94 | V-0 | |
| Material Composition | / | / |
PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
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