3-Layer Rogers PCB Board with RO3006 + Tg170 FR-4 Material 0.86mm Thickness and 98mm x 30mm Size

This high-performance 3-layer rigid PCB is meticulously designed to meet the demanding requirements of various advanced electronic applications. With board dimensions of 98mm x 30mm (1 piece), it boasts precise construction details that ensure reliability and functionality.

The 3-layer rigid PCB has a well-engineered stack-up as follows:

Type of Artwork from customers: Gerber RS-274-X, a widely accepted format for PCB manufacturing data.

PCB Standard: Complies with IPC-Class-2, ensuring good quality and reliability for general electronic products.

This PCB is available worldwide, making it accessible for various global projects.

Rogers RO3006 laminates are ceramic-filled PTFE composites that offer exceptional electrical and mechanical stability. They are specifically designed for use in commercial microwave and RF applications. These advanced circuit materials provide a stable dielectric constant (Dk) over a range of temperatures, eliminating the step change in Dk that occurs for PTFE glass materials near room temperature.

• Ceramic-filled PTFE composites.
• Dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C.
• Dissipation factor of 0.002 at 10 GHz/23°C, ensuring minimal signal loss.
• Td> 500°C, indicating high thermal resistance.
• Thermal Conductivity of 0.79 W/mK, facilitating efficient heat dissipation.
• Moisture Absorption of 0.02%, making it highly resistant to moisture-related issues.
• Coefficient of Thermal Expansion (-55 to 288 °C): X axis 17 ppm/°C, Y axis 17 ppm/°C, Z axis 24 ppm/°C, ensuring dimensional stability across a wide temperature range.

• Uniform mechanical properties for a range of dielectric constants, making it ideal for multi-layer board designs with varying dielectric constants and suitable for use with epoxy glass multi-layer board hybrid designs.
• Low in-plane expansion coefficient (matching copper), allowing for more reliable surface mounted assemblies, making it ideal for applications sensitive to temperature change and providing excellent dimensional stability.
• Volume manufacturing process with economical laminate pricing, ensuring cost-effectiveness for large-scale production.

This PCB, with its use of RO3006, is well-suited for a variety of applications, including:

• Automotive radar applications.
• Global positioning satellite antennas.
• Cellular telecommunications systems - power amplifiers and antennas.
• Patch antenna for wireless communications.
• Direct broadcast satellites.
• Datalink on cable systems.
• Remote meter readers.
• Power backplanes.

This PCB, combining RO3006 and FR-4 materials with a 3-layer stack-up and precise craftsmanship, excels in high-frequency stability, heat dissipation, and dimensional control. It ensures quality through comprehensive electrical testing, making it a practical choice with both performance and reliability for various precision electronic applications.