모크: | 1pcs |
가격: | USD9.99-99.99 |
표준 포장: | 진공 백+상자 |
배달 기간: | 8-9 근무일 |
지불 방법: | t/t |
공급 능력: | 한 달에 5000pc |
Parameter | Specification |
---|---|
Layer Count | 2 layers |
Board Dimensions | 53mm x 36mm (±0.15mm), 1 piece |
Minimum Trace/Space | 4/4 mils, letting dense, complex circuits fit in small spaces without hurting signal quality |
Minimum Hole Size | 0.3mm, fitting small parts like tiny connectors and precision resistors |
Blind Vias | None, simplifying manufacturing and cutting costs while keeping connections reliable |
Finished Thickness | 1.6mm, balancing sturdiness and practicality for space-limited uses |
Outer Cu Weight | 1oz (1.4 mils), ensuring good conductivity for moderate currents |
Via Plating | 20μm thick, boosting interlayer connection durability against thermal and mechanical stress |
Surface Finish | ENIG (Electroless Nickel and Immersion Gold), offering great corrosion resistance and solderability for consistent joints and long life |
Silkscreen | Black on top (easy part ID), none on bottom (simpler layout, lower cost) |
Solder Mask | None on top or bottom, possibly for specific design needs |
Electrical Test | 100% checked before shipping (short circuits, open circuits, impedance) to guarantee function |
Layer | Material/Component | Thickness |
---|---|---|
Copper_layer_1 | Copper | 35 μm |
Core | Rogers Kappa 438 | 1.524 mm (60mil) |
Copper_layer_2 | Copper | 35 μm |
모크: | 1pcs |
가격: | USD9.99-99.99 |
표준 포장: | 진공 백+상자 |
배달 기간: | 8-9 근무일 |
지불 방법: | t/t |
공급 능력: | 한 달에 5000pc |
Parameter | Specification |
---|---|
Layer Count | 2 layers |
Board Dimensions | 53mm x 36mm (±0.15mm), 1 piece |
Minimum Trace/Space | 4/4 mils, letting dense, complex circuits fit in small spaces without hurting signal quality |
Minimum Hole Size | 0.3mm, fitting small parts like tiny connectors and precision resistors |
Blind Vias | None, simplifying manufacturing and cutting costs while keeping connections reliable |
Finished Thickness | 1.6mm, balancing sturdiness and practicality for space-limited uses |
Outer Cu Weight | 1oz (1.4 mils), ensuring good conductivity for moderate currents |
Via Plating | 20μm thick, boosting interlayer connection durability against thermal and mechanical stress |
Surface Finish | ENIG (Electroless Nickel and Immersion Gold), offering great corrosion resistance and solderability for consistent joints and long life |
Silkscreen | Black on top (easy part ID), none on bottom (simpler layout, lower cost) |
Solder Mask | None on top or bottom, possibly for specific design needs |
Electrical Test | 100% checked before shipping (short circuits, open circuits, impedance) to guarantee function |
Layer | Material/Component | Thickness |
---|---|---|
Copper_layer_1 | Copper | 35 μm |
Core | Rogers Kappa 438 | 1.524 mm (60mil) |
Copper_layer_2 | Copper | 35 μm |