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RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

상품

금속 코어 PCB

저희와 연락

Ms. Ivy Deng

sales10@bichengpcb.com

86-755-27374847

지금 연락하세요

RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

모크:	1개
가격:	USD9.99-99.99
표준 포장:	진공 백+상자
배달 기간:	8-9 근무일
지불 방법:	티/티
공급 능력:	한 달에 5000pc

세부 정보 정보

제품 설명

자세한 정보

원래 장소

브랜드 이름

Bicheng

UL, ISO9001, IATF16949

모델 번호

BIC-332.V1.0

기본 자료:

F4BTMS450

레이어 수:

PCB 두께:

1.4mm

PCB 크기:

단위당 20mm x 20mm (공차: ±0.15mm)

실크 스크린:

솔더 마스크:

구리 중량:

1온스(1.4밀/35μm)

표면 마무리:

강조하다:

RF PCB board 4-layer design

Microwave PCB 1.4mm thickness

F4BTMS450 RF PCB board

제품 설명

RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

This 4-layer rigid PCB uses aerospace-grade F4BTM450 material to deliver superior electrical, thermal, and mechanical performance for high-frequency, mission-critical systems. Meeting IPC-Class-2 standards, it provides a high-reliability solution for aerospace, microwave, and military applications and serves as a competitive alternative to premium imported options.

PCB Specification

Parameter	Specification
Base Material	F4BTMS450 (advanced PTFE-nano-ceramic composite)
Layer Configuration	4-layer rigid PCB
Board Dimensions	20mm x 20mm per unit (tolerance: ±0.15mm)
Finished Board Thickness	1.4mm
Copper Weight (Finished)	1oz (1.4 mils / 35μm)
Via Plating Thickness	20μm
Minimum Trace/Space	4 mils / 5 mils
Minimum Hole Size	0.3mm
Vias	4 total (no blind vias)
Surface Finish	Immersion Gold
Silkscreen	Top: No; Bottom: No
Solder Mask	Top: No; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

Precise PCB Stack-up

Copper Layer 1: 35μm (1oz)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 2: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 3: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.762mm (30mil)
Copper Layer 4: 35μm (1oz)

F4BTMS450 Material Advantages

F4BTMS450 is an upgraded iteration of the F4BTM series, featuring a breakthrough formulation of polytetrafluoroethylene (PTFE) resin, ultra-thin/ultra-fine glass fiber cloth, and uniformly distributed special nano-ceramics. Key benefits include:

Minimized electromagnetic wave propagation interference from glass fibers, reducing dielectric loss.
Enhanced dimensional stability and reduced X/Y/Z anisotropy, ensuring consistency across extreme conditions.
Extended usable frequency range, improved electrical strength, and superior thermal conductivity.
Low thermal expansion coefficient and stable dielectric temperature characteristics.
Standard RTF (Reverse Treat Foil) low-roughness copper foil, reducing conductor loss and delivering excellent peel strength (compatible with copper or aluminum bases).

F4BTMS450 Key Electrical & Mechanical Properties

Property	Specification
Dielectric Constant (Dk)	4.5 ±0.09 (10GHz)
Dissipation Factor (Df)	0.0015 (10GHz); 0.0019 (20GHz)
Coefficient of Thermal Expansion (CTE)	X-axis: 12 ppm/°C; Y-axis: 12 ppm/°C; Z-axis: 45 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk	-58 ppm/°C (-55°C to 150°C)
Flame Rating	UL-94 V0
Thermal Conductivity	0.64 W/MK
Moisture Absorption	0.08% (max)

Typical Applications

This PCB is ideal for demanding environments and high-performance systems, including:

Aerospace equipment, space vehicles, and cabin systems
Microwave and RF (Radio Frequency) devices
Military radar and general radar systems
Feed networks for high-frequency applications
Phase-sensitive antennas and phased array antennas
Satellite communications systems
Other mission-critical electronics requiring stable performance under extreme temperatures and conditions.

태그:

상품

모크:	1개
가격:	USD9.99-99.99
표준 포장:	진공 백+상자
배달 기간:	8-9 근무일
지불 방법:	티/티
공급 능력:	한 달에 5000pc

자세한 정보

제품 설명

자세한 정보

원래 장소

중국

브랜드 이름

Bicheng

인증

UL, ISO9001, IATF16949

모델 번호

BIC-332.V1.0

기본 자료:

F4BTMS450

레이어 수:

4 층

PCB 두께:

1.4mm

PCB 크기:

단위당 20mm x 20mm (공차: ±0.15mm)

실크 스크린:

아니요

솔더 마스크:

아니요

구리 중량:

1온스(1.4밀/35μm)

표면 마무리:

몰입 금

최소 주문 수량:

1개

가격:

USD9.99-99.99

포장 세부 사항:

진공 백+상자

배달 시간:

8-9 근무일

지불 조건:

티/티

공급 능력:

한 달에 5000pc

강조하다

RF PCB board 4-layer design

Microwave PCB 1.4mm thickness

F4BTMS450 RF PCB board

제품 설명

RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

PCB Specification

Parameter	Specification
Base Material	F4BTMS450 (advanced PTFE-nano-ceramic composite)
Layer Configuration	4-layer rigid PCB
Board Dimensions	20mm x 20mm per unit (tolerance: ±0.15mm)
Finished Board Thickness	1.4mm
Copper Weight (Finished)	1oz (1.4 mils / 35μm)
Via Plating Thickness	20μm
Minimum Trace/Space	4 mils / 5 mils
Minimum Hole Size	0.3mm
Vias	4 total (no blind vias)
Surface Finish	Immersion Gold
Silkscreen	Top: No; Bottom: No
Solder Mask	Top: No; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

Precise PCB Stack-up

Copper Layer 1: 35μm (1oz)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 2: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 3: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.762mm (30mil)
Copper Layer 4: 35μm (1oz)

F4BTMS450 Material Advantages

Minimized electromagnetic wave propagation interference from glass fibers, reducing dielectric loss.
Enhanced dimensional stability and reduced X/Y/Z anisotropy, ensuring consistency across extreme conditions.
Extended usable frequency range, improved electrical strength, and superior thermal conductivity.
Low thermal expansion coefficient and stable dielectric temperature characteristics.
Standard RTF (Reverse Treat Foil) low-roughness copper foil, reducing conductor loss and delivering excellent peel strength (compatible with copper or aluminum bases).

F4BTMS450 Key Electrical & Mechanical Properties

Property	Specification
Dielectric Constant (Dk)	4.5 ±0.09 (10GHz)
Dissipation Factor (Df)	0.0015 (10GHz); 0.0019 (20GHz)
Coefficient of Thermal Expansion (CTE)	X-axis: 12 ppm/°C; Y-axis: 12 ppm/°C; Z-axis: 45 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk	-58 ppm/°C (-55°C to 150°C)
Flame Rating	UL-94 V0
Thermal Conductivity	0.64 W/MK
Moisture Absorption	0.08% (max)

Typical Applications

This PCB is ideal for demanding environments and high-performance systems, including:

Aerospace equipment, space vehicles, and cabin systems
Microwave and RF (Radio Frequency) devices
Military radar and general radar systems
Feed networks for high-frequency applications
Phase-sensitive antennas and phased array antennas
Satellite communications systems
Other mission-critical electronics requiring stable performance under extreme temperatures and conditions.

태그:

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금속 코어 PCB

RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

RF PCB board 4-layer design

Microwave PCB 1.4mm thickness

F4BTMS450 RF PCB board

1oz RF PCB Board,

1.6mm RF PCB Board,

타코닉 PCB

Rogers PCB 널

PTFE PCB 보드

높은 Tg PCB

다층 PCB

타코닉 PCB

HDI PCB 널

고속 PCB

임피던스 제어 PCB

가동 가능한 PCB 널

fr4 pcb 널

PCB (폴리염화비페닐) 스텐실

금속 코어 PCB

RF PCB board 4-layer design

Microwave PCB 1.4mm thickness

F4BTMS450 RF PCB board

1oz RF PCB Board,

1.6mm RF PCB Board,