모크: | 1pcs |
가격: | USD9.99-99.99 |
표준 포장: | 진공 백+상자 |
배달 기간: | 8-9 근무일 |
지불 방법: | t/t |
공급 능력: | 한 달에 5000pc |
Parameter | Technical Details |
---|---|
Base Material | IsoClad 933 (high-performance dielectric material) |
Layer Count | 2-layer rigid configuration |
Board Dimensions | 155.4mm × 188mm ±0.15mm |
Minimum Trace/Space | 4/6 mils |
Minimum Hole Size | 0.3mm |
Vias | No blind vias; via plating thickness 20 μm |
Finished Board Thickness | 1.6mm |
Finished Copper Weight | 1oz (1.4 mils) for outer layers |
Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
Top Silkscreen | White |
Bottom Silkscreen | No |
Top Solder Mask | Black |
Bottom Solder Mask | No |
Quality Assurance | 100% electrical testing (continuity, isolation) |
모크: | 1pcs |
가격: | USD9.99-99.99 |
표준 포장: | 진공 백+상자 |
배달 기간: | 8-9 근무일 |
지불 방법: | t/t |
공급 능력: | 한 달에 5000pc |
Parameter | Technical Details |
---|---|
Base Material | IsoClad 933 (high-performance dielectric material) |
Layer Count | 2-layer rigid configuration |
Board Dimensions | 155.4mm × 188mm ±0.15mm |
Minimum Trace/Space | 4/6 mils |
Minimum Hole Size | 0.3mm |
Vias | No blind vias; via plating thickness 20 μm |
Finished Board Thickness | 1.6mm |
Finished Copper Weight | 1oz (1.4 mils) for outer layers |
Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
Top Silkscreen | White |
Bottom Silkscreen | No |
Top Solder Mask | Black |
Bottom Solder Mask | No |
Quality Assurance | 100% electrical testing (continuity, isolation) |