| 모크: | 1pcs |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 백+상자 |
| 배달 기간: | 8-9 근무일 |
| 지불 방법: | t/t |
| 공급 능력: | 한 달에 5000pc |
| Parameter | Technical Details |
|---|---|
| Base Material | IsoClad 933 (high-performance dielectric material) |
| Layer Count | 2-layer rigid configuration |
| Board Dimensions | 155.4mm × 188mm ±0.15mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.3mm |
| Vias | No blind vias; via plating thickness 20 μm |
| Finished Board Thickness | 1.6mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Black |
| Bottom Solder Mask | No |
| Quality Assurance | 100% electrical testing (continuity, isolation) |
| 모크: | 1pcs |
| 가격: | USD9.99-99.99 |
| 표준 포장: | 진공 백+상자 |
| 배달 기간: | 8-9 근무일 |
| 지불 방법: | t/t |
| 공급 능력: | 한 달에 5000pc |
| Parameter | Technical Details |
|---|---|
| Base Material | IsoClad 933 (high-performance dielectric material) |
| Layer Count | 2-layer rigid configuration |
| Board Dimensions | 155.4mm × 188mm ±0.15mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.3mm |
| Vias | No blind vias; via plating thickness 20 μm |
| Finished Board Thickness | 1.6mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Black |
| Bottom Solder Mask | No |
| Quality Assurance | 100% electrical testing (continuity, isolation) |