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F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold

F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold

모크: 1pcs
가격: USD9.99-99.99
표준 포장: 진공 백+상자
배달 기간: 8-9 근무일
지불 방법: t/t
공급 능력: 한 달에 5000pc
자세한 정보
원래 장소
중국
브랜드 이름
Bicheng
인증
UL, ISO9001, IATF16949
모델 번호
BIC-052.V1.0
기본 자료:
F4BTMS255
레이어 수:
2 층
PCB 두께:
1.6mm
PCB 크기:
87mm x 80mm(±0.15mm)
구리 중량:
외부 레이어: 1온스(1.4밀)
표면 마감:
몰입 금
강조하다:

RF PCB double-sided 60mil thick

,

immersion gold RF PCB board

,

double-sided PCB with immersion gold

제품 설명
F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold

This double-sided PCB is engineered to meet the rigorous demands of high-reliability industries. It utilizes the advanced F4BTMS255 base material to deliver exceptional signal integrity, thermal stability, and mechanical durability. The board is compliant with IPC-Class-2 standards, undergoes 100% electrical testing prior to shipment, and is available for worldwide shipping.

 

Core Advantage: F4BTMS255 Aerospace-Grade Base Material

The F4BTMS255 is an upgraded flagship material, building on the F4BTM series with breakthroughs in formulation and manufacturing. It combines ultra-thin ultra-fine glass fiber cloth and uniformly distributed nano-ceramics with PTFE resin, minimizing glass fiber interference on electromagnetic waves while boosting key performance metrics. This makes it a direct replacement for premium foreign materials, ideal for aerospace and high-frequency applications.

 

Key Features of F4BTMS255

Performance Indicator

Specification

Dielectric Constant (Dk)

2.55 ± 0.04 at 10GHz (stable for high-frequency signals)

Dissipation Factor

0.0012 at 10GHz; 0.0013 at 20GHz (ultra-low loss for signal integrity)

CTE (Coefficient of Thermal Expansion)

X-axis: 15 ppm/°C; Y-axis: 20 ppm/°C; Z-axis: 80 ppm/°C (-55°C to 288°C)

Thermal Coefficient of Dk

-92 ppm/°C (-55°C to 150°C, ensures stable performance across temperatures)

Flame Rating

UL-94 V0 (enhanced safety for critical environments)

Moisture Absorption

0.025% (resists environmental degradation for long-term reliability)

 

It also includes RTF low-roughness copper foil as standard (reduces conductor loss, improves peel strength) and is compatible with both copper and aluminum bases.

 

1. PCB Specifications

Parameter Details & Benefits
Layer Count Double-sided (2-layer rigid PCB) – balances performance and design flexibility

Board Dimensions

87mm x 80mm per piece (tolerance: ±0.15mm) – precise for consistent assembly
Minimum Trace/Space 5/7 mils – supports dense circuitry for compact, high-density designs
Minimum Hole Size 0.3mm (no blind vias) – simplifies assembly and reduces production complexity
Finished Board Thickness 1.6mm – consistent thickness for reliable mounting and mechanical stability
Finished Copper Weight 1oz (1.4 mils); 35μm per copper layer – ensures strong current carrying capacity
Via Plating Thickness 20μm – guarantees robust electrical connectivity between layers
Surface Finish Immersion Gold – superior corrosion resistance, excellent solderability, and long-term reliability
Silkscreen Top: White; Bottom: None – clear component labeling (top side) without unnecessary bottom-side interference
Solder Mask Top: None; Bottom: None – ideal for applications requiring unobstructed signals (e.g., RF, microwave)
Quality Assurance 100% Electrical Test prior to shipment – eliminates defects, ensures 100% functionality

 

F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold 0

 

2. PCB Stack-up

Layer Order Material Thickness
1 Copper Layer 1 35μm
2 F4BTMS255 Core 1.524mm (60mil)
3 Copper Layer 2 35μm

 

3. Quality Compliance

Artwork Format: Gerber RS-274-X (industry-standard format for seamless manufacturing collaboration)

 

Quality Standard: IPC-Class-2 (meets strict criteria for commercial/industrial applications, ensuring consistent quality)

 

4. Typical Applications

 

This PCB is engineered for scenarios where performance and reliability are non-negotiable:

 

-Aerospace equipment (spacecraft, cabin systems)

-Microwave and RF devices

-Military/commercial radar systems

-Feed networks

-Phase-sensitive antennas (phased array antennas)

-Satellite communications systems

 

5. Global Availability

We offer worldwide shipping, ensuring timely delivery to support your projects—whether you operate in North America, Europe, Asia, or beyond.

 

Ready to Start Your Project?

If you need a high-performance PCB for aerospace, RF, or critical applications, contact us today for a custom quote or technical consultation.

 

F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold 1

상품
제품 세부 정보
F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold
모크: 1pcs
가격: USD9.99-99.99
표준 포장: 진공 백+상자
배달 기간: 8-9 근무일
지불 방법: t/t
공급 능력: 한 달에 5000pc
자세한 정보
원래 장소
중국
브랜드 이름
Bicheng
인증
UL, ISO9001, IATF16949
모델 번호
BIC-052.V1.0
기본 자료:
F4BTMS255
레이어 수:
2 층
PCB 두께:
1.6mm
PCB 크기:
87mm x 80mm(±0.15mm)
구리 중량:
외부 레이어: 1온스(1.4밀)
표면 마감:
몰입 금
최소 주문 수량:
1pcs
가격:
USD9.99-99.99
포장 세부 사항:
진공 백+상자
배달 시간:
8-9 근무일
지불 조건:
t/t
공급 능력:
한 달에 5000pc
강조하다

RF PCB double-sided 60mil thick

,

immersion gold RF PCB board

,

double-sided PCB with immersion gold

제품 설명
F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold

This double-sided PCB is engineered to meet the rigorous demands of high-reliability industries. It utilizes the advanced F4BTMS255 base material to deliver exceptional signal integrity, thermal stability, and mechanical durability. The board is compliant with IPC-Class-2 standards, undergoes 100% electrical testing prior to shipment, and is available for worldwide shipping.

 

Core Advantage: F4BTMS255 Aerospace-Grade Base Material

The F4BTMS255 is an upgraded flagship material, building on the F4BTM series with breakthroughs in formulation and manufacturing. It combines ultra-thin ultra-fine glass fiber cloth and uniformly distributed nano-ceramics with PTFE resin, minimizing glass fiber interference on electromagnetic waves while boosting key performance metrics. This makes it a direct replacement for premium foreign materials, ideal for aerospace and high-frequency applications.

 

Key Features of F4BTMS255

Performance Indicator

Specification

Dielectric Constant (Dk)

2.55 ± 0.04 at 10GHz (stable for high-frequency signals)

Dissipation Factor

0.0012 at 10GHz; 0.0013 at 20GHz (ultra-low loss for signal integrity)

CTE (Coefficient of Thermal Expansion)

X-axis: 15 ppm/°C; Y-axis: 20 ppm/°C; Z-axis: 80 ppm/°C (-55°C to 288°C)

Thermal Coefficient of Dk

-92 ppm/°C (-55°C to 150°C, ensures stable performance across temperatures)

Flame Rating

UL-94 V0 (enhanced safety for critical environments)

Moisture Absorption

0.025% (resists environmental degradation for long-term reliability)

 

It also includes RTF low-roughness copper foil as standard (reduces conductor loss, improves peel strength) and is compatible with both copper and aluminum bases.

 

1. PCB Specifications

Parameter Details & Benefits
Layer Count Double-sided (2-layer rigid PCB) – balances performance and design flexibility

Board Dimensions

87mm x 80mm per piece (tolerance: ±0.15mm) – precise for consistent assembly
Minimum Trace/Space 5/7 mils – supports dense circuitry for compact, high-density designs
Minimum Hole Size 0.3mm (no blind vias) – simplifies assembly and reduces production complexity
Finished Board Thickness 1.6mm – consistent thickness for reliable mounting and mechanical stability
Finished Copper Weight 1oz (1.4 mils); 35μm per copper layer – ensures strong current carrying capacity
Via Plating Thickness 20μm – guarantees robust electrical connectivity between layers
Surface Finish Immersion Gold – superior corrosion resistance, excellent solderability, and long-term reliability
Silkscreen Top: White; Bottom: None – clear component labeling (top side) without unnecessary bottom-side interference
Solder Mask Top: None; Bottom: None – ideal for applications requiring unobstructed signals (e.g., RF, microwave)
Quality Assurance 100% Electrical Test prior to shipment – eliminates defects, ensures 100% functionality

 

F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold 0

 

2. PCB Stack-up

Layer Order Material Thickness
1 Copper Layer 1 35μm
2 F4BTMS255 Core 1.524mm (60mil)
3 Copper Layer 2 35μm

 

3. Quality Compliance

Artwork Format: Gerber RS-274-X (industry-standard format for seamless manufacturing collaboration)

 

Quality Standard: IPC-Class-2 (meets strict criteria for commercial/industrial applications, ensuring consistent quality)

 

4. Typical Applications

 

This PCB is engineered for scenarios where performance and reliability are non-negotiable:

 

-Aerospace equipment (spacecraft, cabin systems)

-Microwave and RF devices

-Military/commercial radar systems

-Feed networks

-Phase-sensitive antennas (phased array antennas)

-Satellite communications systems

 

5. Global Availability

We offer worldwide shipping, ensuring timely delivery to support your projects—whether you operate in North America, Europe, Asia, or beyond.

 

Ready to Start Your Project?

If you need a high-performance PCB for aerospace, RF, or critical applications, contact us today for a custom quote or technical consultation.

 

F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold 1

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