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F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold

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중국 Bicheng Electronics Technology Co., Ltd 인증
중국 Bicheng Electronics Technology Co., Ltd 인증
고객 검토
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— 부유한 리켓

루스, 나는 오늘 PCB를 얻었고 그들이 단지 완벽합니다. 약간의 인내를 멈추게 하시오 그러면 내 다음 명령은 곧 다가오고 있습니다. 종류는 함부르크로부터 주목합니다 올라프

—— 올라프 쿤홀드

하와이 나탈리. 그것은 완벽했습니다, 내가 참고를 위해 약간의 사진을 첨부합니다. 그리고 나는 예산에 당신에게 다음 2 사업을 보냅니다. 다시 대단히 감사합니다

—— 세바스챤 탑리제크

케빈, 감사, 그들이 완전히 만들어졌고, 잘 작동합니다. 약속된 대로 당신이 나를 위해 제조한 PCB를 사용하는 내 최근의 프로젝트를 위한 링크가 여기 있습니다 : 관계, 다니엘

—— 다니엘 포드

제가 지금 온라인 채팅 해요

F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold

F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold
F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold

큰 이미지 :  F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold

제품 상세 정보:
원래 장소: 중국
브랜드 이름: Bicheng
인증: UL, ISO9001, IATF16949
모델 번호: BIC-052.V1.0
결제 및 배송 조건:
최소 주문 수량: 1pcs
가격: USD9.99-99.99
포장 세부 사항: 진공 백+상자
배달 시간: 8-9 근무일
지불 조건: t/t
공급 능력: 한 달에 5000pc

F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold

설명
기본 자료: F4BTMS255 레이어 수: 2 층
PCB 두께: 1.6mm PCB 크기: 87mm x 80mm(±0.15mm)
구리 중량: 외부 레이어: 1온스(1.4밀) 표면 마감: 몰입 금
강조하다:

RF PCB double-sided 60mil thick

,

immersion gold RF PCB board

,

double-sided PCB with immersion gold

F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold

This double-sided PCB is engineered to meet the rigorous demands of high-reliability industries. It utilizes the advanced F4BTMS255 base material to deliver exceptional signal integrity, thermal stability, and mechanical durability. The board is compliant with IPC-Class-2 standards, undergoes 100% electrical testing prior to shipment, and is available for worldwide shipping.

 

Core Advantage: F4BTMS255 Aerospace-Grade Base Material

The F4BTMS255 is an upgraded flagship material, building on the F4BTM series with breakthroughs in formulation and manufacturing. It combines ultra-thin ultra-fine glass fiber cloth and uniformly distributed nano-ceramics with PTFE resin, minimizing glass fiber interference on electromagnetic waves while boosting key performance metrics. This makes it a direct replacement for premium foreign materials, ideal for aerospace and high-frequency applications.

 

Key Features of F4BTMS255

Performance Indicator

Specification

Dielectric Constant (Dk)

2.55 ± 0.04 at 10GHz (stable for high-frequency signals)

Dissipation Factor

0.0012 at 10GHz; 0.0013 at 20GHz (ultra-low loss for signal integrity)

CTE (Coefficient of Thermal Expansion)

X-axis: 15 ppm/°C; Y-axis: 20 ppm/°C; Z-axis: 80 ppm/°C (-55°C to 288°C)

Thermal Coefficient of Dk

-92 ppm/°C (-55°C to 150°C, ensures stable performance across temperatures)

Flame Rating

UL-94 V0 (enhanced safety for critical environments)

Moisture Absorption

0.025% (resists environmental degradation for long-term reliability)

 

It also includes RTF low-roughness copper foil as standard (reduces conductor loss, improves peel strength) and is compatible with both copper and aluminum bases.

 

1. PCB Specifications

Parameter Details & Benefits
Layer Count Double-sided (2-layer rigid PCB) – balances performance and design flexibility

Board Dimensions

87mm x 80mm per piece (tolerance: ±0.15mm) – precise for consistent assembly
Minimum Trace/Space 5/7 mils – supports dense circuitry for compact, high-density designs
Minimum Hole Size 0.3mm (no blind vias) – simplifies assembly and reduces production complexity
Finished Board Thickness 1.6mm – consistent thickness for reliable mounting and mechanical stability
Finished Copper Weight 1oz (1.4 mils); 35μm per copper layer – ensures strong current carrying capacity
Via Plating Thickness 20μm – guarantees robust electrical connectivity between layers
Surface Finish Immersion Gold – superior corrosion resistance, excellent solderability, and long-term reliability
Silkscreen Top: White; Bottom: None – clear component labeling (top side) without unnecessary bottom-side interference
Solder Mask Top: None; Bottom: None – ideal for applications requiring unobstructed signals (e.g., RF, microwave)
Quality Assurance 100% Electrical Test prior to shipment – eliminates defects, ensures 100% functionality

 

F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold 0

 

2. PCB Stack-up

Layer Order Material Thickness
1 Copper Layer 1 35μm
2 F4BTMS255 Core 1.524mm (60mil)
3 Copper Layer 2 35μm

 

3. Quality Compliance

Artwork Format: Gerber RS-274-X (industry-standard format for seamless manufacturing collaboration)

 

Quality Standard: IPC-Class-2 (meets strict criteria for commercial/industrial applications, ensuring consistent quality)

 

4. Typical Applications

 

This PCB is engineered for scenarios where performance and reliability are non-negotiable:

 

-Aerospace equipment (spacecraft, cabin systems)

-Microwave and RF devices

-Military/commercial radar systems

-Feed networks

-Phase-sensitive antennas (phased array antennas)

-Satellite communications systems

 

5. Global Availability

We offer worldwide shipping, ensuring timely delivery to support your projects—whether you operate in North America, Europe, Asia, or beyond.

 

Ready to Start Your Project?

If you need a high-performance PCB for aerospace, RF, or critical applications, contact us today for a custom quote or technical consultation.

 

F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold 1

연락처 세부 사항
Bicheng Electronics Technology Co., Ltd

담당자: Ms. Ivy Deng

전화 번호: 86-755-27374946

팩스: 86-755-27374848

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